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Published online by Cambridge University Press: 01 February 2011
Photoresist droplets are ejected onto a wafer surface by an acoustic two dimensional micromachined ejector array. The spread of single droplets on a silicon wafer surface at varying droplet speeds is studied. Series of photoresist droplets are printed periodically drop-on-demand on a silicon wafer surface and profiles of a single droplet and two droplets overlapping with varying distances of 25 μm and 1 μm on a silicon wafer are demonstrated. Moreover, 3.4 μm thick spinless full coverage of a 4 inch wafer with photoresist is demonstrated which indicates a potential for coating wafers in less than a few seconds.