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Dislocation Emission from a Thin-Film-Covered Crack

Published online by Cambridge University Press:  15 February 2011

Tong-Yi Zhang
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, P.R. China
Cai-Fu Qian
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, P.R. China
Tianhong Wang
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, P.R. China
Pin Tong
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, P.R. China
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Abstract

The present work investigates the effects of a passive film formed during stress corrosion cracking on ductile/brittle fracture behavior, considering the interaction of a dislocation with a thin- film-covered crack under an applied remote load. The dislocation emission from the thin-film- covered crack tip is analyzed, on the basis of the two-dimensional Rice-Thomson model, for screw and edge dislocations. The results show that the nominally critical stress intensity factor for dislocation emission is related to the thin film thickness, the properties of the film and the loading conditions. For a given loading mode and a given crack length, there exists a critical value of the film thickness at which the film does not influence the dislocation emission. When the film thickness is smaller than the critical value, a harder thin film makes the dislocation emission easier and a softer film makes the dislocation emission more difficult. The opposite is also true if the film thickness is larger than the critical value.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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