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Direct Writing of Copper Lines from Copper Formate Precursors Using a Nd:Yag-Laser
Published online by Cambridge University Press: 21 February 2011
Abstract
An effective method is described for laser induced additive formation of copper conductor lines on alumina substrates. The direct writing process allows for depositions with speeds of up to 50 mm/s and a resolution of about 10 microns with reliable adhesion of the deposited patterns.
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- Copyright © Materials Research Society 1990
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