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Dimpling of Cadmium Telluride Samples for Transmission Electron Microscopy

Published online by Cambridge University Press:  21 February 2011

Michael E. Lee ,
E. O. de Neijs  and
A. M. Letsoalo
Michael E. Lee
Affiliation:
Electron Microscope Unit, University of the North, Private Bag X1106 Sovenga 0727, Republic of South Africa
A. M. Letsoalo
Affiliation:
Department of Physics, University of the North, Private Bag X1106 Sovenga 0727, Republic of South Africa
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Abstract

A technique for preparing thin sections in CdTe samples for transmission electron microscopy by a method of mechanical dimpling combined with chemical etching has been investigated. The dimpling rates and surface morphologies of dimpled (100) CdTe samples as a function of pressure, abrasive size and viscosity are presented. This technique produces dimpled samples of well controlled geometries and surface morphologies and offers the advantage of a high dimpling rate and the precise determination of the dimple position. The disadvantage of this technique is that a final application of chemical etching or atom milling is still required to produce electron thin sections.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 115: Symposium W – Specimen Preparation for Transmission Electron Microscopy of Materials I , 1987 , 193
Copyright
Copyright © Materials Research Society 1988

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References

REFERENCES

1. Zanio, K., Semiconductors and Semimetals 13 (New York, Academic Press, 1978), p. 53.Google Scholar
2. Weiruch, D.F., J. Electrochem. Soc. 132, 250 (1985)CrossRefGoogle Scholar
3. Braun, C., Helberg, H.W., George, A., Phil. Mag. A 53, 277 (1986)CrossRefGoogle Scholar
4. Lee, M.E., Letsoalo, A.M., Muller, R.J., Proc. Electr. Micro. South Afr. 16, 17 (1986)Google Scholar
5. Carey, G.P., Cole, S., Yamashita, T., Silberman, J.A., Spicer, W.E., Wilson, J.A., J. Vac. Science and Tech. A 3, 255 (1985).Google Scholar
6. Lee, M.E., presented at the 1987 SAIP Conference, Durban RSA, 1987 (unpublished)Google Scholar
7. M.C.P. Electronic Materials Ltd., Workingham, Berksire, England RG 11 2Q2Google Scholar
8. South Bay Technology, 5209 Tyler Avenue, Temple City, Ca 91780, USAGoogle Scholar