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Diffusion Barriers with Sputtered TaN, Ta-Si-N, and TaSix for Thermal Stable Contact

Published online by Cambridge University Press:  28 February 2011

W.G. Wang ,
C.S. Chang ,
W.S. Chen  and
F.S. Huang
W.G. Wang
Affiliation:
Institute of Electrical Engineering, National Tsing-Hua Univ. Hsin -Nhu, Taiwan, R.O.C.
C.S. Chang
Affiliation:
Institute of Electrical Engineering, National Tsing-Hua Univ. Hsin -Nhu, Taiwan, R.O.C.
W.S. Chen
Affiliation:
Institute of Electrical Engineering, National Tsing-Hua Univ. Hsin -Nhu, Taiwan, R.O.C.
F.S. Huang
Affiliation:
Institute of Electrical Engineering, National Tsing-Hua Univ. Hsin -Nhu, Taiwan, R.O.C.
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Abstract

Tantalum nitride, Ta-Si-N, and tantalum silicide films were investigated for use as a diffusion barrier in Al/Si metallization. The former two films were deposited by reactive sputtering of a Ta or TaSi2 target in Ar/N2 gas mixture. The TaSix films were fabricated by sputtering of TaSi2 target. Then, the Ta-Si-N and TaSix film were annealed at temperature 950°C for 15 seconds by RTA. The resistivities of Ta-Si-N, TaN, and TaSix films are about 180, 250, and 60 µohm-cm, respectively. The X-ray photoelectron spectroscopies were made to study the chemical structure of the films. For both nitrides, TaO comprises the native oxide formed at room temperature. A large amount of silicon nitride was formed on the surface of TaSix film during the RTA. Rutherford backscattering and Auger profile were performed to understand the degradation. It was found that these three films are effective diffusion barriers at temperature 620°C.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 224: Symposium F – Rapid Thermal and Integrated Processing I , 1991 , 67
Copyright
Copyright © Materials Research Society 1991

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References

(1) Wittmer, M.: Appl. Phys. Lett. 37, 540(1980)CrossRefGoogle Scholar
(2) Farooq, M.A. and Murarka, S.P.: J. Appl. Phys. 65(8), 3017(1989)CrossRefGoogle Scholar
(3) Kolawa, E., Molarius, J.M., Nieh, C.W., and Nicolet, M.A.: J. Vac. Sci. Tech. A8(3), 3006(1990)CrossRefGoogle Scholar
(4) Petrovic, R., Nenadovic, T., Kraljevic, N., and Dimitrijeic, T.: Thin Solid Films. 57, 333(1979)CrossRefGoogle Scholar
(5) Yamagishi, Haruo and Miyauchi, Masayoshi: Jpn. J. Appl. Phys. 26(6), 852(1987)CrossRefGoogle Scholar
(6) Sasaki, K., Noya, A. and Umezawa, T.: Jpn. J. Appl. Phys. 29(6), 1043(1990)CrossRefGoogle Scholar
(7) Thomas, J.H. III, and Hammer, L.H.: J. Electrochem. Soc. 136(7), 2004(1989)CrossRefGoogle Scholar
(8) Lngo, G.M. and Zacchetti, N.: J. Vac. Sci. Tech. A7(5), 3048(1989)Google Scholar
(9) Neppl, F., , Fischer And Schwabe, U.: Thin Solid Film, 120, 257(1984)CrossRefGoogle Scholar