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Dielectric Properties Of Low Dielectric Constant Polymeric Materials

Published online by Cambridge University Press:  15 February 2011

Flora S. Ip  and
Chiu Ting
Flora S. Ip
Affiliation:
SEMATECH 2706 Montopolis Dr., Austin TX 78741 On Assignment from Advanced Micro Devices, Austin, TX
Chiu Ting
Affiliation:
SEMATECH 2706 Montopolis Dr., Austin TX 78741 On Assignment from Intel Corp., Santa Clara, CA
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Abstract

Multilevel interconnects for high performance ULSI need low dielectric constant materials for inter-metal layer dielectric, or ILD, to reduce signal propagation delay, power consumption and cross talk noises. We have studied the physical, dielectric and processing properties of a wide variety of promising low dielectric polymeric materials for ILD applications. This paper presents capacitance values measured over a wide range of temperature, and a summary of the measured dielectric properties. The anisotropy 1,2 of dielectric properties were determined experimentally, the vertical (out-of-plane) dielectric properties were determined by MIM (Metal-Insulator-Metal) measurements, and the horizontal (in-plane) dielectric properties were determined by intra-line measurements of sub-half micron serpentine and comb test structures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 381: Symposium F – Low-Dielectric Constant Materials--Synthesis and Applications in Micro. , 1995 , 135
Copyright
Copyright © Materials Research Society 1995

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References

1. Boese, D., Herminghaus, S., Yoon, D. Y., Swalen, J. D., and Rabolt, J.F., ”Stiff Polyimides: Chain orientation and Anisotropy of the optical and Dielectric Properties of Thin Films,” MRS Symposium Proceedings, vol.227, pp. 379–386.Google Scholar
2. Lin, L., PhD thesis: “Molecular Orientation Studies of Spin-Coated Polyimide Films”, Georgia Institute of Technology, April 1994.Google Scholar
3. Subramanian, et al., “Effect of Moisture on the Physical Properties of Polyimide Films”, MRS Symposium Proceedings, vol.227, pp. 147–154.Google Scholar
4. Hasegawa, T., Kobayashi, T., Kadomura, S. and Aoyama, J., ”Simulaticn of Capacitance of Low Dielectric Interlayer,” DUMIC Conference Proceedings, 1995.Google Scholar
5. Schwartz, , Huang, Y-S, Patrick, W., ”The Effective Dielectric Constant of Silicon Dioxides Deposited in the Spaces Between Adjacent Conductors,” J. Electrochem. Soc., Vol.139, 12, pp. 118–122Google Scholar