Hostname: page-component-78c5997874-mlc7c Total loading time: 0 Render date: 2024-11-05T04:23:40.469Z Has data issue: false hasContentIssue false
  • English
  • Français

Diamond Heat Sinks For High Temperature Electronics: Simuilation, And Thermal Analysis

Published online by Cambridge University Press:  10 February 2011

Nickolaos Strifas  and
Aris Christou
Nickolaos Strifas
Affiliation:
Materials & Nuclear Engineering Department, University of Maryland, College Park, MD 20742 Tel (301) 405-5208(301) 314-2029
Aris Christou
Affiliation:
Materials & Nuclear Engineering Department, University of Maryland, College Park, MD 20742 Tel (301) 405-5208(301) 314-2029
Get access

Abstract

performance that can be achieved by utilizing a diamond heat - sink design which minimizes junction - to - case thermal resistance. Effects of the thermal conductivity of the substrate material, the thermal conductivity of the die attach material, the substrate thickness, and the die attach thickness onl Ihe thermal resistance are addressed. The results indicate that the temperature increase could be 3 to 4 times less with diamond heat-sinks when compared to other materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 416: Symposium DD – Diamond for Electronic Applications , 1995 , 101
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Chapman, C. L., Lee, S., Schmidt, B. L., “Thermal Performance of an Elliptical Pin Fin Heat Sink,” IEEE Annual Semiconductor Thermal Measurements & Management Symposium, 1992.Google Scholar
2. Keyes, R. W., “Heat Transfer in Forced Convection Through Fins,” IEEE Transactions on Electronic Devices, Vol. ED- 31, No. 9, 19984.Google Scholar
3. Kumar, N., MCC Report # P/1–265-91, 1991.Google Scholar