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Development of Evaluation Method for Delamination Strength Between Micro-Sized Materials in MEMS Devices

Published online by Cambridge University Press:  26 February 2011

Chiemi Ishiyama ,
Junichi Hata ,
Satoru Koyama ,
Masato Sone  and
Yakichi Higo
Chiemi Ishiyama
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
Junichi Hata
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
Satoru Koyama
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
Masato Sone
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
Yakichi Higo
Affiliation:
[email protected], Tokyo Institute of Technology, Precision and Intelligence Labratory, 4259 Nagatsuta, Midoriku, Yokohama, 226-8503, Japan
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Abstract

Evaluation method for delamination strength of micro-sized materials has been developed using by FEM and measurement of load-displacement curve of micro-sized specimen. This evaluation method is applied to micro-sized cylindrical SU-8 specimens on Si substrate. The maximum shear stress between SU-8 and Si was analyzed with FEM. Fracture load required to delaminate the two materials was examined using a mechanical testing machine for micro-sized materials, which have been developed in our group. The delamination strength was determined from the maximum shear stress and the fracture load.

Keywords

adhesionmicroelectro-mechanical (MEMS)strength
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 977: Symposium FF – Processing-Structure-Mechanical Property Relations in Composite Materials , 2006 , 977-FF04-29
Copyright
Copyright © Materials Research Society 2007

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References

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