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Determination of Density of Localized States in Amorphous Silicon Alloys From the Low Field Conductance of Thin N-I-N Diodes

Published online by Cambridge University Press:  28 February 2011

Michael Shur
Affiliation:
Department of Electrical Engineering, University of Minnesota, Minneapolis, MN 55455
Michael Hack
Affiliation:
ECD, Inc., 1675 West Maple Road, Troy, MI 48084
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Abstract

We describe a new technique to determine the bulk density of localized states in the energy gap of amorphous silicon alloys from the temperature dependence of the low field conductance of n-i-n diodes. This new technique allows us to determine the bulk density of states in the centre of a device, and is very straightforward, involving fewer assumptions than other established techniques. Varying the intrinsic layer thickness allows us to measure the,density of states within approximately 400 meV of midgap.

We measured the temperature dependence of the low field conductance of an amorphous silicon alloy n-i-n diode with an intrinsic layer thjckness of 0.45 microns and deduced the density of localised states to be 3xlO16cm−3 eV−1 at approximately 0.5 eV below the bottom of the conduction band. We have also considered the high bias region (the space charge limited current regime) and proposed an interpolation formula which describes the current-voltage characteristics of these structures at all biases and agrees well with our computer simulation based on the solution of the complete system of transport equations.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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References

1. Wronski, C. R., Abeles, B., Tiedje, T. and Cody, G. D., Solid State Comm., 449 1423, (1982).CrossRefGoogle Scholar
2. Street, R. A., Zesch, J., Thompson, M. J., Appl. Phys. Lett., 43, 672, (1983).CrossRefGoogle Scholar
3. Hyun, C., Shur, M. S., Hack, M., Yaniv, Z. and Cannella, V., Appl. Phys. Lett., 45, 11, 1202, (1984).CrossRefGoogle Scholar
4. Viktorovitch, P., J. Appl. Phys., 52, 1392, (1981).CrossRefGoogle Scholar
5. Ziel, Van der, Shur, M. S., Lee, K., Chen, T. H., and Amberadis, K., IEEE Trans. Electron Devices, ED–30, 128, (1983).CrossRefGoogle Scholar
6. Shur, M. and Hack, M., J. Appl. Phys., Aug. 1985.Google Scholar
7. Hack, M. and Shur, M., J. Appl. Phys., 54, 5858, (1983).CrossRefGoogle Scholar
8. Weisfield, R. L., J. Appl. Phys., 54 (11), 6401, (1981).CrossRefGoogle Scholar