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Design an Electroplated Frame Freestanding Specimen for Microtensile Testing of Submicron thin TaN and Cu Film

Published online by Cambridge University Press:  01 February 2011

Ming-Tzer Lin ,
Chi-Jia Tong  and
Chung-Hsun Chiang
Ming-Tzer Lin
Affiliation:
[email protected], National Chung Hsing University, Institute of Precision Engineering, 250 Kuo Kuang Rd, Taichung, Taiwan, 402, Taiwan
Chi-Jia Tong
Affiliation:
[email protected], National Chung Hsing University, Institute of Precision Engineering, 250 Kuo Kuang Rd, Taichung, 402, Taiwan
Chung-Hsun Chiang
Affiliation:
[email protected], National Chung Hsing University, Institute of Precision Engineering, 250 Kuo Kuang Rd, Taichung, 402, Taiwan
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Abstract

A novel design electroplating spring frame structure specimen is demonstrated here. The specimen can be fit into a specially designed microtensile apparatus which is capable of carrying out a series of tests on submicron scale freestanding thin films.

Certain thin films applicable in CMOS interconnect and low K materials were tested including sputtered Copper, Tantalum Nitride thin films. Metal specimens were fabricated by sputtering. For Tantalum Nitride film samples, Nitrogen gas was introduced into the chamber during sputtering Tantalum films on the silicon wafer.

We found the modulus of Copper and Tantalum Nitride thin films thin films with thickness of 200 to 800nm at room temperature.

Keywords

Custress/strain relationshipbarrier layer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F09-16
Copyright
Copyright © Materials Research Society 2006

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References

references

1 Vinci, R.P. et. al. Thin solid film, 262 142–153 (1995)Google Scholar
2 Saha, Ranjana et al, Jounral of crystal growth 174 495–500 (1997)Google Scholar
3 , Kim et. al. Journal of Applied Physics Volume 92 Number 12 7080–7085 Dec 2002 Google Scholar
4 Noda, Suguru et. al. J. Vac. Sci. Technology. A22(2) Mar/Apr 2004,Google Scholar
5 , Liang et. al. Solide State Communications 133 117–120 (2005),Google Scholar
6 , Chong et. al. Surface & Coatings Technology 198 287–290 (2005)Google Scholar
7 , Wang et. al. 2005 Surface & Coatings Technology 193 173–177 (2005)Google Scholar
8 Ruud, J.A., Josell, D., Spaepen, F., and Greer, A.L., J. Mater. Res. 8, 112 (1993).Google Scholar
9 Read, D.T. and Dally, J.W., Int. J. of Microcircuits Elec. Pack. 16(4), 313 (1993).Google Scholar
10 Marsh, D.M., J.Sci.Inst. 36, 165 (1959).Google Scholar
11 Neugebauer, C.A., J. Appl. Phys. 31, 1096 (1960).Google Scholar
12 Henning, C.A.O., Boswell, F.W., and Corbett, J.M., Acta Met. 23, 177 (1975).Google Scholar
13 Emery, R.D. and Povirk, G.L. Acta Materialia 51 2067–2078 (2003)Google Scholar
14 Haque, M.A. and Saif, M.T.A., Experimental mechanics, 42(1), 123–128 (2001).Google Scholar
15 Haque, M.A. and Saif, M.T.A., Sensors and Actuators A 97–98, 239–245(2002).Google Scholar
16 Schreiber, E. et al. Elastic Constants and Their Measurement. McGraw-Hill, New York 1973.Google Scholar
17 Hertzberg, R., 1996, Deformation and Fracture Mechanics of Engineering Materials, fourth edition (New York: Wiley), p. 7.Google Scholar
18 Jamting, K. et al. Thin Solid Films, 304–309 (1997)Google Scholar
19 Farhat, Z.N. et al., Surface and Coatings Technology 89 (1997) 24–30 Google Scholar
20 Sanders, P. G. et al. Acta mater. Vol. 45, No. 10, pp. 4019–4025 (1997)Google Scholar
21 Read, D.T., Int. J. Fatigue Vol. 20, No. 3, pp. 203–209. 1998 Google Scholar
22 Legros, M. et al., Philosophical magazine A, 2000, VOL. 80, NO. 4, 1017–1026 Google Scholar
23 Suresh, S. et al., Scripta Materialia, Vol. 41, No. 9, pp. 951–957, 1999 Google Scholar
24 Huang, H. et al., Acta mater. 48 (2000) 3261–3269 Google Scholar
25 Zhao, Jie-Hua et al., Journal of applied physisc VOLUME 87, NUMBER 3, 2000 Google Scholar
26 Fang, Te-Hua et al., Microelectronic Engineering 65 (2003) 231–238 Google Scholar
27 Zhou, Yong et al. Thin Solid Films 460 (2004) 175–180 Google Scholar
28 Soifer, Ya. M. et al. Materials Letters 59, 1434–1438 (2005)Google Scholar
29 , Raghuram et. al. J. Vac. Sci. Technol. 9 (1972) 1389 Google Scholar
30 Nordin, Maria et. al. Surface and Coatings Technology 120–121 (1999) 528–534 Google Scholar