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Design an Electroplated Frame Freestanding Specimen for Microtensile Testing of Submicron thin TaN and Cu Film

Published online by Cambridge University Press:  01 February 2011

Ming-Tzer Lin ,
Chi-Jia Tong  and
Chung-Hsun Chiang
Ming-Tzer Lin
Affiliation:
[email protected], National Chung Hsing University, Institute of Precision Engineering, 250 Kuo Kuang Rd, Taichung, Taiwan, 402, Taiwan
Chi-Jia Tong
Affiliation:
[email protected], National Chung Hsing University, Institute of Precision Engineering, 250 Kuo Kuang Rd, Taichung, 402, Taiwan
Chung-Hsun Chiang
Affiliation:
[email protected], National Chung Hsing University, Institute of Precision Engineering, 250 Kuo Kuang Rd, Taichung, 402, Taiwan
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Abstract

A novel design electroplating spring frame structure specimen is demonstrated here. The specimen can be fit into a specially designed microtensile apparatus which is capable of carrying out a series of tests on submicron scale freestanding thin films.

Certain thin films applicable in CMOS interconnect and low K materials were tested including sputtered Copper, Tantalum Nitride thin films. Metal specimens were fabricated by sputtering. For Tantalum Nitride film samples, Nitrogen gas was introduced into the chamber during sputtering Tantalum films on the silicon wafer.

We found the modulus of Copper and Tantalum Nitride thin films thin films with thickness of 200 to 800nm at room temperature.

Keywords

Custress/strain relationshipbarrier layer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F09-16
Copyright
Copyright © Materials Research Society 2006

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