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Deposition of aluminum Oxynitride Films by Magnetron Sputtering: Effect of Bombardment and Substrate Heating on Structural and Mechanical Properties

Published online by Cambridge University Press:  21 February 2011

Russell V. Smilgys
Affiliation:
Science applications international Corp., 1710 Goodridge Dr., McLean, VA 22102
Eric Takamura
Affiliation:
GeoCenters, 10903 indian Head Highway, Fort Washington, MD 20744
Irwin L. Singer
Affiliation:
Naval Research Laboratory, Washington, D.C. 20375
Steven W. Robey
Affiliation:
National institute of Standards and Technology, Gaithersburg, MD 20899
Douglas A. Kirkpatrick
Affiliation:
Science applications international Corp., 1710 Goodridge Dr., McLean, VA 22102
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Abstract

Aluminum oxynitride films, 1 μm thick, are deposited onto glass substrates by planar magnetron sputtering from an alumina target in a mixture of nitrogen and argon. one set of films is deposited onto glass substrates that are heat sunk to a holder, whose temperature is held below 100°C. a second set of films is deposited onto glass substrates that are mechanically clamped to a holder, whose temperature is allowed to rise up to 250°C. Characterization by continuous indentation testing, secondary electron microscopy, and x-ray diffraction reveals significant differences in mechanical properties and surface structure between the two sets of films. Films deposited with holder cooling have a smooth surface and no evidence of crystallinity; films deposited without holder cooling have etch pits on their surface that vary with position across the substrate. the later films show crystallinity and have twice the hardness and a 60% greater elastic modulus.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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