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Degradation in Sn Films due to Whisker Formation

Published online by Cambridge University Press:  26 February 2011

L. Reinbold ,
Eric Chason ,
N. Jadhav ,
V. Kelly ,
P. Holmes ,
J.W. Shin ,
W.L. Chan ,
K.S. Kumar  and
G. Barr
L. Reinbold
Affiliation:
[email protected]
Eric Chason
Affiliation:
[email protected], Brown University, Division of Engineering, United States
N. Jadhav
Affiliation:
[email protected]
V. Kelly
Affiliation:
[email protected]
P. Holmes
Affiliation:
[email protected]
J.W. Shin
Affiliation:
[email protected]
W.L. Chan
Affiliation:
[email protected]
K.S. Kumar
Affiliation:
[email protected]
G. Barr
Affiliation:
[email protected]
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Abstract

Whisker formation in pure Sn coatings on Cu conductors is a serious impediment to the development of Pb-free electronics manufacturing. Understanding whisker formation is complicated by the fact that it is the result of multiple materials kinetic processes including interdiffusion, intermetallic formation and stress generation We report preliminary studies of whisker growth kinetics and stress evolution aimed at developing a fundamental understanding of the whisker growth process. A proposed model of point defect mediated stress generation provides a simple picture of how the different processes are connected.

Keywords

coatingSnpackaging
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 887: Symposium Q – Degradation Processes in Nanostructured Materials , 2005 , 0887-Q11-01
Copyright
Copyright © Materials Research Society 2006

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References

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