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Deformation Properties of a Lead-Tin (95–5) Solder

Published online by Cambridge University Press:  25 February 2011

D. Stone ,
H. Wilson ,
R. Subrahmanyan  and
Che-Yu Li
D. Stone
Affiliation:
Department of Materials Science and Engineering Cornell University, Ithaca, NY 14853
H. Wilson
Affiliation:
Department of Materials Science and Engineering Cornell University, Ithaca, NY 14853
R. Subrahmanyan
Affiliation:
Department of Materials Science and Engineering Cornell University, Ithaca, NY 14853
Che-Yu Li
Affiliation:
Department of Materials Science and Engineering Cornell University, Ithaca, NY 14853
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Abstract

Consecutive load relaxation tests are performed on a 95 Pb-5 Sn specimen near room temperature, then at 69 ° C and 1°C. The initial relaxation runs at room temperature show evidence of static recovery, which diminishes after a number of load relaxations have been performed. Evidence of grain boundary sliding is also found. The specimen hardens slowly at 69°C, as manifested by successive load relaxation data falling at lower strain rates. At 1°C, the material slowly softens. These temperature effects are believed to result from a dislocation-solute interaction involving tin atoms in the lead matrix.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 175
Copyright
Copyright © Materials Research Society 1986

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