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Deformation Mechanisms in Thin Films

Published online by Cambridge University Press:  15 February 2011

H. J. Frost
H. J. Frost*
Affiliation:
Thayer School of Engineering, Dartmouth College, Hanover, New Hampshire 03755
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Abstract

There are a variety of different mechanisms which may contribute to the plastic deformation of a polycrystalline material, involving such processes as dislocation glide, dislocation climb, grain boundary sliding and diffusion of vacancies. Each mechanism can be characterized by a relationship which gives strain-rate as a function of stress, temperature and microstructural state. A deformation mechanism may actually involve multiple, coupled atomic processes. For example, diffusional creep results from the coupled operation of vacancy diffusion and grain boundary sliding. The total strain-rate of the polycrystal is the sum of the contributions of the various different mechanisms, with different mechanisms dominant in different regimes of stress and temperature. In bulk polycrystals this behavior has been described with deformation-mechanism maps. For thin films the same atomic processes of deformation can operate, but the deformation mechanisms may have different stress---strain-rate---temperature relationships because of the presense of free surfaces or thin-film---substrate interfaces.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 265: Symposium H – Materials Reliability in Microelectronics II , 1992 , 3
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES AND BIBLIOGRAPHY

1. Nix, W.D., “Mechanical Properties of Thin Films”, Met. Trans. 20A, 2217–2245, 1989.CrossRefGoogle Scholar
2. Alexopoulos, P.S. and O'Sullivan, T.C., “Mechanical Properties of Thin Films”, Annual Review of Materials Science 20, 391–420, 1990.CrossRefGoogle Scholar
3. Kocks, U.F., Argon, A.S. and Ashby, M.F., “Thermodynamics and Kinetics of Slip”, Progress in Materials Science 19, 1975 Google Scholar
4. Mukherjee, A.K., Bird, J.E. & Dorn, J.E.. “Experimental Correlations for High Temperature Creep”, Trans. ASM 62, 155–179, 1969 Google Scholar
5. Robinson, S.L. and Sherby, O.D., “Mechanical Behavior of Polycrystalline Tungsten at Elevated Temperature”, Acta Metall. 17, 109–125, 1969.CrossRefGoogle Scholar
6. Herring, C., “Diffusional Viscosity of a Polycryst. Solid”, J. Appl. Phys. 21,437–45,1950 CrossRefGoogle Scholar
7. Nabarro, F.R.N., Report on a Conf. on the Strength of Metals, Phys. Soc. London, 1948.Google Scholar
8. Coble, R.L., “A Model for Boundary Diffusion Controlled Creep in Polycrystalline Materials”, J. Appl. Phys. 34, 1679–1682, 1963.CrossRefGoogle Scholar
9. Poirier, J.-P., Creep of Crystals, Cambridge Univ. Press, Cambridge, 1985, pp. 114–117.CrossRefGoogle Scholar
10. Garofalo, F., “An Empirical Relation Defining the Stress Dependence of Minimum Creep Rate in Metals”, Trans. TMS-AIME 227, 351–356, 1963.Google Scholar
11. Weertman, J., “Disloc. Climb Theory of Steady-State Creep”, Trans.ASM 61, 681–94, 1968 Google Scholar
12. Ashby, M.F., “A first report on deformation-mechanism maps”, Acta Met. 20, 887–98,1972 CrossRefGoogle Scholar
13. Frost, H.J. and Ashby, M.F., Deformation-Mechanism Maps, Pergamon Press, Oxford, 1982 Google Scholar
14. Weihs, T.P., Hong, S., Bravman, J.C. and Nix, W.D., “Mechanical deflection of cantilever microbeams: A new technique.....”, J. Mater. Res. 3, 931–942, 1988 CrossRefGoogle Scholar
15. Gangulee, A., “Strain-Relaxation in Thin Films on Substrates”, Acta Met. 22, 177–83, 1974 CrossRefGoogle Scholar
16. Sinha, A.K. and Sheng, T.T., “The Temperature Dependence of Stresses in Aluminum Films on Oxidized Silicon Substrates”, Thin Solid Films 48, 117–126, 1978.CrossRefGoogle Scholar
17. Flinn, P.A., Gardner, D.S. and Nix, W.D., “Measurement and Interpretation of Stress in Al-Based Metallization....”, IEEE Trans. on Electron Devices ED–34, 689–699, 1987.CrossRefGoogle Scholar
18. Draper, B. L. and Hill, T.A., “Stress and stress relaxation in integrated circuit metals and dielectrics”, J. Vac. Sci. Technol. B 9, pp. 1956–1962, 1991.CrossRefGoogle Scholar
19. Flinn, P.A., “Measurement and interpretation of stress in Cu films as a function of thermal history”, J. Mater. Res. 6, 1498–1501, 1991.CrossRefGoogle Scholar
20. Hershkovitz, M., Blech, I.A. and Komem, Y., “Stress Relaxation in Thin Aluminium Films”, Thin Solid Films 130, 87–93, 1985.CrossRefGoogle Scholar
21. Jackson, M.S. & Li, C.-Y., “Stress Relax.& Hillock Growth.”, Acta Met 30, p.1993, 1982 CrossRefGoogle Scholar
22. Gardner, D.S. and Flinn, P.A., “Mechanical stress as a function of temperature for aluminum alloy films”, J. Appl. Phys. 67, 1831–1844, 1990.CrossRefGoogle Scholar
23. Murakami, M., “Thermal Strain in Lead Thin Films II: Strain Relaxation Mechanisms”, Thin Solid Films 55, 101–111, 1978.CrossRefGoogle Scholar
24. Doerner, M.F., Gardner, D.S. & Nix, W.D., “Plastic properties of thin films on substrates.. by submicron indentation hardness and substrate curvature..”, J. Mat. Res. 1,845–51,1986.CrossRefGoogle Scholar
25. Stevens, R.N., “Grain Boundary Sliding and Diffusion Creep in Polycrystalline Solids”, Phil. Mag. 23, 265–283, 1971.CrossRefGoogle Scholar
26. Cannon, W. Roger, “The Contribution of Grain Boundary Sliding to Axial Strain during Diffusional Creep”, Phil. Mag. 25, 1489–1497, 1972.CrossRefGoogle Scholar
27. Ashby, M.F. and Verrall, R., “Diffusion-Accommodated Flow and Superplasticity”, Acta Metall. 21, 149–163, 1973.CrossRefGoogle Scholar
28. Raj, R. & Ashby, M.F., “On GB Sliding & Diffusional Creep”, Met.Trans. 2,1113–27, 1971 CrossRefGoogle Scholar
29. Gibbs, G.B., “Diffusion Creep in a Thin Foil”, Phil Mag. 13, 589–593, 1966 CrossRefGoogle Scholar
30. Evans, R.W. & Jones, F.L., “Hot ductility of wrought Cu-Ni alloy”, Metals Tech. 5,1,1978 CrossRefGoogle Scholar
31. Griffin, A.J. Jr., Brotzen, F.R. and Dunn, C., “Hall-Petch Relation in Thin Film Metallizations”, Scripta Metall. 20, 1271–1272, 1986 CrossRefGoogle Scholar
32. Ashby, M.F., Gandhi, C. and Taplin, D.M.R., “Fracture-Mechanism Maps and their construction for F.C.C. Metals and Alloys”, Acta Metall. 27, 699–729, 1979.CrossRefGoogle Scholar
33. Gandhi, C. and Ashby, M.F., “Fracture-Mechanism Maps for materials which cleave: F.C.C., B.C.C. and H.C.P. Metals and Ceramics”, Acta Metall. 27, 1565–1602, 1979.CrossRefGoogle Scholar
34. Hull, D. and Rimmer, D.E., “The Growth of Grain-boundary Voids Under Stress”, Philos. Mag. 4, 673–687, 1959.CrossRefGoogle Scholar
35. Chen, I.-W. & Argon, A.S., “Diffusive Growth of G.B. Cavities”, Acta Met. 29, 1759,1981 CrossRefGoogle Scholar
36. Yost, F.G., Amos, D.E. and Romig, A.D. Jr., “Stress-Driven Diffusive Voiding of Aluminum Conductor Lines”, IEEE/IRPS, pp. 193–200, 1989.CrossRefGoogle Scholar
37. Hinode, K., Owada, N., Nishida, T. and Mukai, K., “Stress-induced grain boundary fractures in Al-Si interconnects”, J. Vac. Sci. Technol. B 5, 518–522, 1987.CrossRefGoogle Scholar
38. Sauter, Anne I. and Nix, W.C., “A study of stress-driven diffusive growth of voids in encapsulated interconnect lines”, J. Mater. Res. 7, 1133–1143, 1992.CrossRefGoogle Scholar
39. Li, C.-Y., Black, R.D. & LaFontaine, W.R., “Analysis of thermal stress-induced grain bdry. cavitation and notching in narrow Al-Si metallizations”, Appl. Phys. Lett. 53, 31–33, 1988 CrossRefGoogle Scholar
40. Korhonen, M.A., Paszkiet, C.A. & Li, C.-Y., “Mechanisms of thermal stress relaxation and stress-induced voiding in narrow Al-based metallizations”, J.Appl.Phys. 69,8083–91,1991 CrossRefGoogle Scholar
41. Artz, E. & Nix, W.D. “..the effect of line width and mech. strength on electromigration failure of interconnects with “near-bamboo” grain structures”, J.Mater.Res. 6,731–36, 1991 Google Scholar
42. Nix, W.D. and Artz, E., “On Void Nucleation and Growth in Metal Interconnect Lines under Electromigration Conditions”, Metallurgical Transactions, in press, 1992.CrossRefGoogle Scholar
43. Korhonen, M.A., Børgensen, P. and Li, Che-Yu, “Electromig. in Al-based Interconnects..... with and without...Stress-Migration Damage”, Mat. Res. Soc. Fall Meeting, 1991.Google Scholar
44. Korhonen, M.A., Børgensen, P., Tu, K.N. and Li, Che-Yu, “Stress Evolution due to Electromigration in Confined Metal Lines, submitted to Journal of Applied Physics, 1992 Google Scholar