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Cure Technology for Controlled Stress in Thin Benzocyclobutene Coatings

Published online by Cambridge University Press:  15 February 2011

P. H. Townsend ,
D. C. Burdeaux ,
T. M. Stokich  and
M. G. Dibbs
P. H. Townsend
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
D. C. Burdeaux
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
T. M. Stokich
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
M. G. Dibbs
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674
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Abstract

The stress at room temperature in many typical polymer coatings used for microelectronic dielectrics is near 40 MPa. Polymer coatings derived from divinylsiloxane bisbenzocyclobutene (BCB), (CAS 117732-87-3), have a stress level of ca. 38 MPa after a conventional thermal oven cure. In this work, a novel approach based on curing the BCB polymeric network in the vitrified state has been used to achieve far field stresses of 24 MPa in the final coatings. This represents a 36% reduction in the far field stress of BCB coatings cured at 250 °C. The cure methodology and compatibility with device process design are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 135
Copyright
Copyright © Materials Research Society 1992

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References

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