Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-25T15:29:56.349Z Has data issue: false hasContentIssue false
  • English
  • Français

Cross Slip in Cu - A Molecular Dynamics Study

Published online by Cambridge University Press:  01 February 2011

Dan Mordehai ,
Guy Makov  and
Itzhak Kelson
Dan Mordehai
Affiliation:
School of Physics and Astronomy, The Raymond and Beverly Sackler Faculty of Exact Sciences, Tel Aviv University, Tel Aviv 69978, Israel.
Guy Makov
Affiliation:
Department of Physics, NRCN, PO.Box 9001, Be'er Sheva, Israel
Itzhak Kelson
Affiliation:
School of Physics and Astronomy, The Raymond and Beverly Sackler Faculty of Exact Sciences, Tel Aviv University, Tel Aviv 69978, Israel.
Get access

Abstract

The annihilations of screw dislocation dipoles via cross-slip in Cu were simulated using constant-temperature constant-stress molecular dynamics. The cross-slip mechanism and annihilation process of flexible dislocations in a large dipole configuration was identified as a dynamic variant of the Friedel-Escaig mechanism. The cross-slip rate was found to exhibit exponential dependence on the temperature, from which the activation enthalpy for the cross-slip process was calculated by the Arrhenius relation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 882: Symposium EE – Linking Length Scales in the Mechanical Behavior of Materials , 2005 , EE7.2
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Abraham, F.F. Broughton, J.Q. and Bernstein, N. Comp. Phys. 12, 538 (1998); H. Gleiter, Acta Mater. 48, 1 (2000); G.H. Campbell, S.M. Foiles, H. Huang, D.A. Hughes, W.E. King, D.H. Lassila, D.J. Nikkel, T.D. de la Rubia, J.Y. Shu, and V.P. Smyshlyaev, Mater. Sci. Eng., 251, 1 (1998).Google Scholar
2PhD thesis, Tejs Vegge, CAMP, Technical University of Denmark (2002)Google Scholar
3 Duesbery, M.S. Modeling Simul. Mater. Sci. Eng. 6, 35 (1998).Google Scholar
4 Püschl, W., Prog. Mater. Sci. 47, 415 (2002).Google Scholar
5 Rasmussen, T. Vegge, T. Leffers, T. Pedersen, O.B. and Jacobsen, K.W. Phil. Mag. A, 80, 1273 (2000).Google Scholar
6 Vegge, T., Rasmussen, T. Leffers, T. Pedersen, O.B. and Jacobsen, K.W. Phys. Rev. B, 85, 3866 (2000).Google Scholar
7 Parrinello, M. and Rahman, R. J. Appl. Phys. 52, 7182 (1981)Google Scholar
8 Nose, S. Mol. Phys. 57, 187 (1984).Google Scholar
9YAshkenazy, . and Kelson, I. Modelling. Simul. Mater. Sci. Eng. 7, 169 (1999).Google Scholar
10 Mordehai, D. Ashkenazy, Y. Kelson, I. Makov, G. Phys Rev. B, 024112 (2003).Google Scholar
11 Hirth, J.P. and Lothe, J. Theory of Dislocations (McGraw-Hill Book Company, USA, 2nd edition, 1968).Google Scholar
12 Fleischer, R. L., Acta Metall. 7, 134 (1959).Google Scholar
13 Schöck, G., Phil. Mag. Lett, 59 (1989) 251; private communication.Google Scholar
14 Bonneville, J. Escaig, B. and Martin, J.L, Acta Metallurgica, 36, 1989 (1988).Google Scholar