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Creep Behavior of a Directionally Solidified Ni3Al Alloy

Published online by Cambridge University Press:  01 January 1992

Yun Zhang
Affiliation:
Department of Materials Science & Engineering, Shanghai Jiao Tong University, Shanghai 200030, P.R.China
Dongliang Lin (T.L.Lin)
Affiliation:
Department of Materials Science & Engineering, Shanghai Jiao Tong University, Shanghai 200030, P.R.China
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Abstract

The creep behavior of a directionally solidified multicomponent Ni3Al alloy was investigated in a temperature range from 923 to 1173 K. The dislocation structure during secondary stage creep has been examined by transmission electron microscopy. At lower temperatures from 923 to 1023K under a stress of 500 MPa, there exist a number of dense three – dimensional dislocation networks in the Ni3Al creep specimen, while at a higher temperature of 1173 K under a stress of 200 MPa the dislocation structure degenerates to regular two – dimensional dislocation networks. Climb of dislocations occurs in the overall test temperture range. The stress dependence and temperature dependence of creep rates for the Ni3Al alloy were also determined. It was found that power law creep is obeyed with the stress exponent equal to 4.7 and the activation energy equal to 326.6 kJ/mol. The climb of dislocations was suggested to be the rate controlling factor for the secondary stage creep rate.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

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