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The Correlation of Adhesion Strength with Barrier Structure in Cu Metallization

Published online by Cambridge University Press:  01 February 2011

A. Sekiguchi ,
J. Koike ,
K. Ueoka ,
J. Ye ,
H. Okamura ,
N. Otsuka ,
S. Ogawa  and
K. Maruyama
A. Sekiguchi
Affiliation:
Dept. of Materials Science, Tohoku University, Sendai 980-8579, Japan
J. Koike
Affiliation:
Dept. of Materials Science, Tohoku University, Sendai 980-8579, Japan
K. Ueoka
Affiliation:
Nissan ARC, Ltd., Yokosuka 237-0061, Japan
J. Ye
Affiliation:
Nissan ARC, Ltd., Yokosuka 237-0061, Japan
H. Okamura
Affiliation:
Backend Process Tech. Group, Semiconductor Leading Edge Technologies, Inc. Tsukuba, Ibaraki 305-8569, Japan
N. Otsuka
Affiliation:
Backend Process Tech. Group, Semiconductor Leading Edge Technologies, Inc. Tsukuba, Ibaraki 305-8569, Japan
S. Ogawa
Affiliation:
Backend Process Tech. Group, Semiconductor Leading Edge Technologies, Inc. Tsukuba, Ibaraki 305-8569, Japan
K. Maruyama
Affiliation:
Dept. of Materials Science, Tohoku University, Sendai 980-8579, Japan
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Abstract

Adhesion strength in sputter-deposited Cu thin films on various types of barrier layers was investigated by scratch test. The barrier layers were Ta1-xNx with varied nitrogen concentration of 0, 0.2, 0.3, and 0.5. Microstructure observation by TEM indicated that each layer consists of mixed phases of β;-Ta, bcc-TaN0.1, hexagonal-TaN, and fcc-TaN, depending on the nitrogen concentration. A sulfur- containing amorphous phase was also present discontinuously at the Cu/barrier interfaces in all samples. Scratch test showed that delamination occurred at the Cu/barrier interface and that the overall adhesion strength increased with increasing the nitrogen concentration. A good correlation was found between the measured adhesion strength and the composing phases in the barrier layer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 766: Symposium E – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics - 2003 , 2003 , E.3.5
Copyright
Copyright © Materials Research Society 2003

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