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Correlation between Processing, Composition, and Mechanical Properties of PECVD-SiN, Thin Films

Published online by Cambridge University Press:  16 February 2011

D. C. H. Yu  and
J. A. Taylor
D. C. H. Yu
Affiliation:
AT&T Bell Laboratories Allentown, PA 18103, U.S.A.
J. A. Taylor
Affiliation:
AT&T Bell Laboratories Allentown, PA 18103, U.S.A.
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Abstract

The inter-relationship between plasma processing, composition, and mechanical properties of PECVD-SiNx, thin films was investigated. Results showed that by varying the gas feeding ratio of NH3/SiH4N2, one can obtain PECVD-SiNx, films of different composition and streu levels. For high stress films, the deposition rate is low, values of index of refraction and Si/N ratio are small. On the other hand, film density of such films is high; values of Young's modulus and N-H/Si-H relative bond density are large. A model which correlates film stress to that contributed by (1) lattice distortion induced by Si-H and NH bondings, (2) ion bombardment, (3) thermal mismatch between PECVD-SiNx films and silicon substrate, and (4) intrinsic stress introduced during the formation of covalent Si-N bonding is proposed and examined in this work.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 188: Symposium K – Thin Films: Stresses and Mechanical Properties II , 1990 , 79
Copyright
Copyright © Materials Research Society 1990

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References

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