Hostname: page-component-78c5997874-mlc7c Total loading time: 0 Render date: 2024-11-19T05:55:07.027Z Has data issue: false hasContentIssue false
  • English
  • Français

Correlation between Controllability of Reset Current and Electrostatic Energy Released from the Self Capacitance of Conducting Bridge Random Access Memory

Published online by Cambridge University Press:  12 June 2012

Kentaro Kinoshita ,
Shigeyuki Tsuruta ,
Sho Hasegawa ,
Takahiro Fukuhara  and
Satoru Kishida
Kentaro Kinoshita
Affiliation:
Department of Information and Electronics, Graduate School of Engineering, Tottori University, 4-101 Koyama-Minami, Tottori 680-8552, Japan. Tottori University Electronic Display Research Center (TEDREC), 522-2 Koyama-Kita, Tottori 680-0941, Japan.
Shigeyuki Tsuruta
Affiliation:
Department of Information and Electronics, Graduate School of Engineering, Tottori University, 4-101 Koyama-Minami, Tottori 680-8552, Japan.
Sho Hasegawa
Affiliation:
Department of Information and Electronics, Graduate School of Engineering, Tottori University, 4-101 Koyama-Minami, Tottori 680-8552, Japan.
Takahiro Fukuhara
Affiliation:
Department of Information and Electronics, Graduate School of Engineering, Tottori University, 4-101 Koyama-Minami, Tottori 680-8552, Japan.
Satoru Kishida
Affiliation:
Department of Information and Electronics, Graduate School of Engineering, Tottori University, 4-101 Koyama-Minami, Tottori 680-8552, Japan. Tottori University Electronic Display Research Center (TEDREC), 522-2 Koyama-Kita, Tottori 680-0941, Japan.
Get access

Abstract

Physical properties of filaments in Cu/HfO2/Pt conducting-bridge memory (CB-RAM) were investigated basing on direct observation by conducting atomic force microscopy (C-AFM) and energy dispersive X-ray spectroscopy (EDS), R-T characteristics until liquid nitrogen temperature, and I-V characteristics both in air and in vacuum. As a result, physical picture of filaments in Cu/HfO2/Pt structures was revealed. Filaments consist of Cu containing large residual resistance and the cross-sectional area of the filament, S fila, was roughly proportional to set voltage, V set, even when current compliance was kept constant. Interestingly, resistivities of filaments are same among all the filaments in different samples and are invariant even after repetitive switching that changes resistance of the filaments. Cu/HfO2/Pt obeyed the universal relation that reset current, I reset, is proportional to the inverse of resistance in a low resistance state, 1/R LRS, which is known to be applicable to oxygen-migration-based resistive switching memories such as Pt/NiO/Pt. Considering the invariance of resistivity of the filament, this suggests the fact that I reset is decided dominantly by S fila. In addition, it was suggested that moisture is necessary for dissolution and migration of Cu to form filaments.

Keywords

ion-solid interactionsmemoryHf
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1430: Symposium E – Materials and Physics of Emerging Nonvolatile Memories , 2012 , mrss12-1430-e08-04
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Waser, R., Dittmann, R., Staikov, G. and Szot, K., Redox-based resistive switching memoriesnanoionic mechanisms, prospects, and challenges, Adv. Mater. 21, 2632 (2009).Google Scholar
2. Kund, M., Beitel, G., Pinnow, C.-U., Rohr, T., Schumann, J., Symanczyk, R., Ufert, K.-D. and Mueller, G., Tech. Dig. Int. Electron Devices Meet, p. 754, 2005.Google Scholar
3. Kozicki, M. N., Park, M., and Mitkova, M., IEEE TRANSACTIONS ON NANOTECHNOLOGY 4, 331 (2005).Google Scholar
4. Sakamoto, T., Sunamura, H., Kawaura, H., Hasegara, T. Nakayama, T. and Aono, M., Appl. Phys. Lett. 82, 3032 (2003).Google Scholar
5. Fujisaki, Y., Jpn. J. Appl. Phys. 45, L991 (2006).Google Scholar
6. Sakamoto, T., Lister, K., and Banno, N., Hasegawa, T., Terabe, K., and Aono, M., Appl. Phys. Lett. 91, 092110 (2007).Google Scholar
7. Tsuruoka, T., Terabe, K., Hasegawa, T., Valov, I., Waser, R., and Aono, M., Adv. Funct. Mater. 22, 70 (2012).Google Scholar
8. Haemori, M., Nagata, T. and Chikyo, T., Appl. Phys. Exp. 2, 061401(2009).Google Scholar
9. Nardi, F., Ielmini, D., Cagli, C., Spiga, S., Fanciulli, M., Goux, L., Wouters, D.J., Solid-State Electronics 58, 42 (2011).Google Scholar
10. Yoda, T., Kinoshia, K., Makino, T., Dobashi, K., Kishida, S., Phys. Status Solidi C 8, 546 (2011).Google Scholar
11. Pourbaix, M.: in Corrosion and Metal Artifacts - A Dialogue Between Conservators and Archaeologists and Corrosion Scientists -, ed. Brown, B. F., Burnett, H. C., Chase, W. T., Goodway, M., Pourbaix, M., Kruger, J. E. (Natl Assn of Corrosion, 1991) pp. 1–16.Google Scholar