Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by Crossref.
Kellock, A.J.
Bardin, T.T.
Wang, P-W.
Baglin, J.E.E.
and
Pronko, J.G.
1989.
Adhesion Studies of Au Films on GaAs using Ion-Assisted Deposition Techniques.
MRS Proceedings,
Vol. 157,
Issue. ,
Rajan, K.
Roy, R. A.
Petkie, R.
and
Ramanathan, K. V.
1989.
Microstructural Characterization of Texture in Tungsten Films made by Ion-Assisted Evaporation.
MRS Proceedings,
Vol. 157,
Issue. ,
WOLF, G.K.
1990.
Metallurgical Coatings and Thin Films 1990.
p.
920.
Hirvonen, James K.
1993.
Ion Beam Assisted Deposition- R&D to Production.
MRS Proceedings,
Vol. 316,
Issue. ,
Hubler, Graham K.
and
Hirvonen, James K.
1994.
Surface Engineering.
p.
593.
Musil, J.
Bell, A. J.
and
Čepera, M.
1995.
Deposition of copper films by unbalanced d.c. magnetron sputtering.
Czechoslovak Journal of Physics,
Vol. 45,
Issue. 3,
p.
249.
Ensinger, W.
1996.
Ion Beam Modification of Materials.
p.
142.
Musil, J.
Mišina, M.
and
Čepera, M.
1996.
Microwave plasma enhanced low pressure d.c. sputtering of copper films.
Czechoslovak Journal of Physics,
Vol. 46,
Issue. 4,
p.
353.
Bailey, W.E.
Guarisco, D.
and
Wang, S.X.
1998.
Effect of microstructure on resistivity and GMR ratio in ion beam deposited spin valves.
IEEE Transactions on Magnetics,
Vol. 34,
Issue. 4,
p.
957.
Fu, Yongqing
Zhu, Xiaodong
Xu, Kewei
and
He, Jiawen
1998.
Mechanical and tribological properties of ion-beam-enhanced-deposition TiN thin films.
Journal of Materials Processing Technology,
Vol. 83,
Issue. 1-3,
p.
209.
Colligon, John S.
1999.
Non-equilibrium Processing of Materials.
Vol. 2,
Issue. ,
p.
225.
Hu, T. L.
Mao, S. W.
Chao, C. P.
Wu, M. F.
Huang, H. L.
and
Gan, D.
2007.
Deposition Characteristics of AlN Thin Film Prepared by the Dual Ion Beam Sputtering System.
Journal of Electronic Materials,
Vol. 36,
Issue. 1,
p.
81.