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Constrained Diffusional Creep in Thin Copper Films

Published online by Cambridge University Press:  18 March 2011

D. Weiss ,
H. Gao  and
E. Arzt
D. Weiss
Affiliation:
Max-Planck-Institut für Metallforschung andInstitut für Metallkunde der Universität, Seestr. 92, D-70174 Stuttgart, Germany
H. Gao
Affiliation:
Max-Planck-Institut für Metallforschung andInstitut für Metallkunde der Universität, Seestr. 92, D-70174 Stuttgart, Germany
E. Arzt
Affiliation:
Max-Planck-Institut für Metallforschung andInstitut für Metallkunde der Universität, Seestr. 92, D-70174 Stuttgart, Germany
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Abstract

The mechanical properties of thin metal films have been investigated for many years. How- ever, the underlying mechanisms are still not fully understood. In this paper we give an overview of our work on thermomechanical properties and microstructure evolution in pure Cu and dilute Cu-Al alloy films. Very clean films were produced by sputtering and annealing under ultra-high vacuum (UHV) conditions. We described stress-temperature curves of pure Cu films with a constrained diffusional creep model from the literature. In Cu-1at.%Al alloy films, Al surface segregation and oxidation led to a “self-passivating” effect. These films showed an increased high- temperature strength because of the suppression of constrained diffusional creep; however, under certain annealing conditions, these films deteriorated due to void growth at grain boundaries.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 673: Symposium P – Dislocations and Deformation Mechanisms in Thin Films and Small Structures , 2001 , P1.2
Copyright
Copyright © Materials Research Society 2001

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References

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