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Computer Simulation of Channeling Profile Analysis of Implantation Damage

Published online by Cambridge University Press:  10 February 2011

Matthias Posselt*
Affiliation:
Institute of Ion Beam Physics and Materials Research, Forschungszentrum Rossendorf, P.O.Box 510119, D-01314 Dresden, Germany
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Abstract

Channeling profile analysis is simulated using the dynamic binary collision code Crystal- TRIM. A good agreement between theoretical and experimental data is found for silicon targets which were predamaged by Si+ ions of different energies and analyzed by 140 keV B+ ions. For each example the depth profile of the defects relevant for the dechanneling of the analyzing ions is given. An estimate of the annealing of such defects is obtained by comparison of results for as-implanted and annealed samples.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

2. Schmidt, B., Posselt, M., Strecker, N. and Feudel, T., Semiconductor Process and Device Performance Modeling, edited by Nelson, J.S., Wilson, C.D. and Dunham, S.T., MRS Symp. Proc. 490 (1997) to be published.Google Scholar
1. Tian, S., Wang, G., Morris, M., Morris, S., Obradovic, B., Tasch, A., Kennel, H., Packan, P., Magee, C., Sheng, J., Lowther, R., Linn, J. and Snell, C., SISPAD 1997 Tech. Dig., pp. 309312.Google Scholar
4. Kennel, H.W., private communication.Google Scholar
3. Packan, P., Kennel, H., Thompson, S., Corcoran, S. and Taylor, M., Proc. of the 11th Int. Conf. on Ion Implantation Technology, edited by Ishida, E., Banerjee, S., Mehta, S., Smith, T.C., Current, M. and Larson, L., IEEE 96TH8182 (1996) pp. 539542.Google Scholar
5. Posselt, M., Schmidt, B., Murthy, C.S., Feudel, T. and Suzuki, K., J. Electrochem. Soc. 144, 1495 (1997).Google Scholar
6. Posselt, M., Radiat. Eff. and Def. in Solids 130/131, 87 (1994).Google Scholar
7. Murthy, C. S., Posselt, M. and Frei, T., J. Vac. Sci. & Technol. B14, 278 (1996).Google Scholar
8. Caturla, M. J., de la Rubia, T. Diaz, Marques, L.A. and Gilmer, G.H., Phys. Rev. B54, 16683 (1996).Google Scholar
9. Ziegler, J.F., Biersack, J.P. and Littmark, U., The Stopping and Range of Ions in Solids, Pergamon Press, New York, 1985.Google Scholar
10. Hobler, G., Radiat. Eff. and Def. in Solids 139, 21 (1996).Google Scholar