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Complete Characterization of Thermoelectric Materials by a Combined van der Pauw Approach and the Effect of Radiation Losses

Published online by Cambridge University Press:  14 March 2011

Johannes de Boor  and
Volker Schmidt
Johannes de Boor
Affiliation:
Max Planck Institute of Microstructure Physics, Weinberg 2, 06120 Halle, Germany
Volker Schmidt
Affiliation:
Max Planck Institute of Microstructure Physics, Weinberg 2, 06120 Halle, Germany
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Abstract

We have recently presented a novel method for a complete thermoelectric characterization [J. de Boor, V. Schmidt. Adv. Mater. 22:4303, (2010)]. This method is based on the well-known electrical van der Pauw method and allows measurement of the electrical and thermal conductivity, the Seebeck coefficient and the thermoelectric figure of merit. After a short review of this method we will discuss the systematic measurement errors of the method. It turns out that radiative heat loss can affect the thermal conductivity measurement significantly. We will give a simple estimation for the relative error due to radiation losses and discuss error minimizing strategies.

Keywords

thermoelectricthermal conductivityradiation effects
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1314: Symposium LL – Thermoelectric Materials for Solid-State Power Generation and Refrigeration , 2011 , mrsf10-1314-ll07-01
Copyright
Copyright © Materials Research Society 2011

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References

[1] Snyder, G. S. and Toberer, E. S.. Nat. Mater., 7(2):105–114, 2008.Google Scholar
[2] van der Pauw, L. J.. Philips Research Reports, 13:1–9, 1958.Google Scholar
[3] Paul, O., Plattner, L., and Baltes, H.. P. IEEE, 12:56–61, 1999.Google Scholar
[4] de Boor, J. and Schmidt, V.. Adv. Mater., 22(38):4303–4307, 2010.Google Scholar
[5] Busch, G. and Steigmeier, E.. Helv. Phys. Acta, 34:1, 1961.Google Scholar
[6] Lienhard, J. H. IV and Lienhard, J. H. V. A Heat Transfer Textbook. Phlogiston Press, Cambridge, Massachusetts, USA, 2008.Google Scholar
[7] Leveque, G. and Nouaoura, M.. Eur. Phys. J-Appl. Phys., 4(2):227–233, 1998.Google Scholar
[8] Weiss, J. D., Kaplar, R. J., and Kambour, K. E.. Solid State Electron., 52(1):91–98, 2008.Google Scholar
[9] Kasl, C. and Hoch, M.J.R.. Rev. Sci. Instrum., 76(3), 2005.Google Scholar