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CMP related/CMP revealed short- and long-range integration interactions in copper dual damascene technology

Published online by Cambridge University Press:  18 March 2011

Yehiel Gotkis  and
Rodney Kistler
Yehiel Gotkis
Affiliation:
Lam Research Corporation, Fremont, CA, USA
Rodney Kistler
Affiliation:
Lam Research Corporation, Fremont, CA, USA
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Extract

More than 4 years have passed since IBM made the official announcement approving copper dual damascene (Cu2D) technology, which drew the rest of the semiconductor world into the Cu2D race. And the technology appeared to be a hard nut to crack. Nowadays, after more than three years of extensive R&D work, the EOL yields are still low, and a lot of process integration work has to be done to make it mass production ready.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 671: Symposium M – Chemical-Mechanical Polishing 2001–Advances and Future Challenges , 2001 , M5.2
Copyright
Copyright © Materials Research Society 2001

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