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Chemical and Structural Characterization of Silane Adhesion Promoting Films for Use in Microelectronic Packaging

Published online by Cambridge University Press:  01 February 2011

Maura Jenkins ,
Jeffrey Snodgrass ,
Reinhold H. Dauskardt  and
John C. Bravman
Maura Jenkins
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, U.S.A.
Jeffrey Snodgrass
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, U.S.A.
Reinhold H. Dauskardt
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, U.S.A.
John C. Bravman
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, U.S.A.
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Abstract

We investigate the mechanism by which an aminosilane adhesion promoter strengthens the interface between benzocyclobutene (BCB) and an oxidized silicon wafer. The adhesion promoter film is characterized using AFM and angle-resolved XPS to identify surface bond density, morphology, and chemistry for a range of adhesion promoter spin-coat solution concentrations. The adhesion strength of the SiO2 / adhesion promoter / BCB interface was also evaluated. The 0.0083% solution produces what appears to be a single monolayer on the surface, while the 0.014% concentration yields two monolayers. In both cases, the directionality of the films is preserved. That is, the amine functional group is oriented toward the BCB, and the silane groups are oriented toward the silicon oxide substrate. Finally, this solution concentration is optimized with respect to the mechanical strength of the interface, and 0.01% concentration is found to perform best. When the adhesion data is plotted versus the calculated surface bond density, a nearly linear relationship is seen, supporting a direct correlation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 629: Symposium FF – Interfaces, Adhesion and Processing in Polymer Systems , 2000 , FF5.12
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Kook, S.Y., Snodgrass, J.M., Kirtikar, A., Dauskardt, R.H., Journal of Electronic Packaging, Transactions of the ASME (1998).Google Scholar
2. Ma, Q., Fujimoto, H., Flynn, P., Jain, V., Adibi-Rizi, F., Dauskardt, R.H., MRS Symp. Proc. V. 391: Materials Reliability in Microelectronics V, Proc. MRS Annual Meeting, San Francisco, CA. 1995. p. 91–96.Google Scholar
3. Iler, R. K., The Chemistry of Silica, 2nd ed. (Wiley & Sons, New York, 1979).Google Scholar
4. Spruytte, S., Coldren, C., Harris, J., Pantelidis, D., Lee, H.-J., Bravman, J., Kelly, M.. Unpublished work, submitted to Journal of Vacuum Science and Technology.Google Scholar
5. Gull, S. F. and Skilling, J., IEE Proceedings 131 F (6), 646 (1984).Google Scholar
6. Livesey, A. K. and Smith, G. C., Journal of Electron Spectroscopy and Related Phenomena 67, 439 (1994).Google Scholar
7. Donnelly, V., Angresnu Program. (Lucent Technologies, Murray Hill, NJ, 07974).Google Scholar
8. Eng, J. and Opila, R.. Unpublished work.Google Scholar