Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-29T06:01:39.009Z Has data issue: false hasContentIssue false
  • English
  • Français

Characterizing the Modulus and Hardness of Photopatternable Silicone Compositions Using Depth Sensing Nanoindentation

Published online by Cambridge University Press:  15 February 2011

Brian R. Harkness ,
Richard L. Schalek ,
Satyen K. Sarmah  and
Lawrence T. Drzal
Brian R. Harkness
Affiliation:
Dow Corning Corporation 2200 W. Salzburg Road, Midland, MI 48686, U.S.A
Richard L. Schalek
Affiliation:
Department of Chemical Engineering and Materials Science Michigan State University, East Lansing, MI, 48824, U.S.A.
Satyen K. Sarmah
Affiliation:
Dow Corning Corporation 2200 W. Salzburg Road, Midland, MI 48686, U.S.A
Lawrence T. Drzal
Affiliation:
Department of Chemical Engineering and Materials Science Michigan State University, East Lansing, MI, 48824, U.S.A.
Get access

Abstract

The mechanical properties of two cured silicone monolithic specimens with targeted bulk moduli of 300 and 10 MPa have been evaluated by DMA and regionally by CSM nanoindentation. The results showed that the mechanical properties of the monolithic samples were heterogeneous, with the DMA and nanoindention results only in agreement at the midplane of cleaved bulk samples. The specimens showed a significantly higher modulus at the sample surfaces compared to the bulk. Thin films of the same silicones displayed a modulus closer to that of the bulk sample surface. The nanoindentation results of this study were reliable and consistent, and are being used to assess the effects of material and microelectronic device integration processes on the mechanical properties of a series of low modulus photopatternable silicone thin film dielectrics.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 769: Symposium H – Flexible Electronics - Materials and Device Technology , 2003 , H9.5
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Larson, L.J., Alger, S., Dent, S.J., Gardner, G.B., Harkness, B.R. an Nelson, R.T., 35th International Symposium on Microelectronics, IMAPS 2002, Denver, Colorado, p.795.Google Scholar
2. Li, X.D. and Bhushan, B., Materials Characterization, 48, 11, (2002).Google Scholar
3. Fischer-Cripps, A.C., Nanoindentation, Springer-Verlag, New York, NY (2002).Google Scholar
4. Lucas, B.N., Oliver, W.C., and, G.M. Pharr Loubet, J.L. in Thin Films: Stresses and Mechanical Properties, edited by Gerberich, W.W., Gao, H., Sundgren, J.E. and Baker, S.P., (Mat. Res. Soc. Symp. Proc.) 436, 1996 Google Scholar
5. Cappella, B. and Dietler, G., Surface Science Reports, 34, 1 (1999).Google Scholar