Hostname: page-component-cd9895bd7-fscjk Total loading time: 0 Render date: 2024-12-27T02:17:17.627Z Has data issue: false hasContentIssue false

Characterization of P+-Implanted Silicon

Published online by Cambridge University Press:  25 February 2011

N. David Theodore
Affiliation:
Motorola Inc., Advanced Technology Center, 2200 W. Broadway Rd., Mesa, AZ 85202
Lynnita Knoch
Affiliation:
Motorola Inc., Advanced Technology Center, 2200 W. Broadway Rd., Mesa, AZ 85202
Jim Christiansen
Affiliation:
Motorola Inc., Advanced Technology Center, 2200 W. Broadway Rd., Mesa, AZ 85202
M. Pan
Affiliation:
Motorola Inc., Advanced Technology Center, 2200 W. Broadway Rd., Mesa, AZ 85202
Get access

Abstract

Dopant species can interact in different ways with interfaces, layers of varied microstructures, and with extended-defects. An understanding of such interactions is relevant to semiconductor processing and device-fabrication. In this study, the behavior of phosphorus-implanted silicon wafers was characterized using transmission electron microscopy (TEM), for as-implanted as well as post-implant rapid thermal-anneal (RTA) conditions. The top layers of as-implanted wafers were found to be amorphized. A correlation was seen between the presence of the amorphous-to-crystalline silicon interface and a drop in phosphorus concentrations in depth-profiles obtained using SIMS (secondary-ion mass-spectrometry). Reasons for the drop in concentration are explored, one of which is a higher diffusivity for phosphorus in amorphous silicon than in crystalline silicon. The top layers of wafers subjected to a RTA had recrystallized. A band of extended defects was present in the vicinity of the original amorphous-to-crystalline silicon interface. A correlation was seen between the presence of these defects and a secondary peak in phosphorus concentrations (in depth profiles) obtained using SIMS. These effects are explained in terms of gettering of phosphorus to the extended-defects. The band of extended-defects consists of dislocation loops, point-defect clusters, and extended dislocations that arise due to coalescing of point defects followed by annealing of the resulting extended-defects. The point-defects themselves arise from the implantation.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Corbett, J.W. et al, Nucl. Instrum. and Meth. 182/183, 457 (1981).Google Scholar
2. Hall, B.O., Nucl. Instrum. and Meth. B16, 177 (1986).CrossRefGoogle Scholar
3. Theodore, N.D., Ch. 3, Ph.D. Thesis, Cornell University, 1991.Google Scholar
4. Ashburn, P. et al, Solid St. Electron. 20, 731 (1977).Google Scholar
5.Quick Reference Manual for Silicon Integrated Circuit Technology,” Beadle, W.E., Tsai, J.C.C., and Plummer, R.D., Editors, pp. 712, Wiley-Interscience, New York (1985).Google Scholar
6. Kendall, De Vries, Semiconductor Silicon 1969, 414; quoted in “Quick Reference Manual for Si IC Technology” (Eds. Beadle et al).Google Scholar
7. Zhang, H., Haneman, D., Shi, Z.R., J. Appl. Phys. 66 (10), 4958 (1989).Google Scholar
8. Sasano, A., Matsumaru, H., Kaneko, Y., Tsukada, T., J. Non-Cryst. Sol. 97–98 (2), 1295 (1987).CrossRefGoogle Scholar
9. Tsai, J.C.C., Schimmel, D.G., Fair, R.B., Maszara, W., J. Electrochem. Soc., 134 (6), 1508 (1987).CrossRefGoogle Scholar
10. Borucki, Len, Motorola Inc. [private communication, past experience with Monte Carlo simulation], 1991.Google Scholar