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Characterization of Metal/Si1-xGex/Si Diodes Fabricated by Cryogenic Processing

Published online by Cambridge University Press:  15 February 2011

L. He
Affiliation:
Department of Electrical Engineering, Northern Illinois University, DeKalb, IL
E. Li
Affiliation:
Department of Electrical Engineering, Northern Illinois University, DeKalb, IL
Z.Q. Shi
Affiliation:
NEOCERA, Inc., College Park, MD
R.L. Jiang
Affiliation:
Department of Physics, Nanjing University, Nanjing 210008, P.R.China
J. L. Liu
Affiliation:
Department of Physics, Nanjing University, Nanjing 210008, P.R.China
Y. Shi
Affiliation:
Department of Physics, Nanjing University, Nanjing 210008, P.R.China
Y.D. Zheng
Affiliation:
Department of Physics, Nanjing University, Nanjing 210008, P.R.China
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Abstract

Schottky diodes were fabricated by evaporating metal thin layers on p-Si1-xGex by cryogenic processing. The cryogenic processing, with substrate temperature cooled to as low as 77K (LT), has been successfully used to enhance metal/III-V semiconductor Schottky barrier height[1]. The electrical characteristics of the diodes were investigated by current-voltage (IV) and current-temperature (I-T) measurements. In order to study the effect of silicide formation on diode characteristics, furnace annealing was performed in nitrogen atmosphere at 450°C and 550°C, respectively. Two kinds of samples with gemanium composition x of 0.17 and 0.20 were used. The electrical characteristics showed the barrier height фB decreased with the increase of the gemanium composition. The annealing temperatures up till to 550°C did not affect the I-V characteristics at room temperature, however, the conduction mechanism showed obvious difference comparing to the as-deposited diodes by I-V-T analysis. For Pd as Schottky metal, very similar results were obtained for the LT as-deposited diodes and the ordinary room temperature (RT) deposited diodes after 550° annealing, they both showed thermionic emission dominated conduction mechanism.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1. Shi, Z. Q. and Anderson, W. A., J. Appl. Phys. 72, 3803 (1992)Google Scholar
2. Xiao, X., Sturm, J. C., Parihar, S. R., Lyon, S. A., Meyerhofer, D., Palfrey, S. and Shallcross, F. V., IEEE Electron Device Lett. 14, 199 (1993)Google Scholar
3. Kanaya, H., Hasegawa, F., Yamaka, E., T. Moriyama and Nakajima, M., Jpn. J. Appl. Phys. 28, L544 (1989)Google Scholar
4. Jimenez, J. R., Xiao, X., J.Sturm, C., Pellegrini, P. W. and Weeks, M. M.. J. Appl. Phys. 75, 5160 (1994)Google Scholar
5. Aubry, V., Meyer, F. Warren, P. and Dutartre, D., Appl. Phys. Lett. 63, 2520 (1993)Google Scholar
6. Zheng, Y., Zhang, R., Jiang, R., Hu, L., Zhong, P., Mo, S., Yu, S., Li, Q. and Feng, D., Proceedings of 20th International Conference on the Physics of Semiconductors, edited by Anastassakis, E. M. and Joannopoulos, J. D. (World Scientific, Singapore, 1990), p. 869 Google Scholar
7. Rhoderick, E. H. and Williams, R. H., eds., Metal-Semiconductor Contacts, 2nd edition, (Oxford Science Publications, 1988), p. 108 Google Scholar
8. Shi, Z. Q., Anderson, W. A., Fu, L. P. and Petrou, A., Solid-State Electron., 36, 147 (1993)Google Scholar