Hostname: page-component-cd9895bd7-dk4vv Total loading time: 0 Render date: 2024-12-27T02:31:48.789Z Has data issue: false hasContentIssue false
  • English
  • Français

Characterization of chemically modified thin films for optimization of metal CMP applications

Published online by Cambridge University Press:  19 July 2013

G. Bahar Basim ,
Ayse Karagoz  and
Zeynep Ozdemir
G. Bahar Basim
Affiliation:
Ozyegin University, Faculty of Engineering, Mechanical Engineering Department, Alemdag, Istanbul, Turkey
Ayse Karagoz
Affiliation:
Ozyegin University, Faculty of Engineering, Mechanical Engineering Department, Alemdag, Istanbul, Turkey
Zeynep Ozdemir
Affiliation:
Ozyegin University, Faculty of Engineering, Mechanical Engineering Department, Alemdag, Istanbul, Turkey
Get access

Abstract

Metal CMP applications necessitate the formation of a protective oxide film in the presence of surface active agents, oxidizers, pH regulators and other chemicals to achieve global planarization. Formation and mechanical properties of the chemically modified metal oxide thin films in CMP determine the stresses develop at the interfaces delineating the stability and protective nature of the chemically altered films on the surface of the metal wafer. The balance between the stresses built in the film structure versus the mechanical actions provided during the process can be used to optimize the process variables and furthermore help define new planarization techniques for the next generation microelectronic device manufacturing. In this study, the preliminary studies were concentrated on the very well established tungsten CMP applications and furthermore, titanium CMP applications were presented as a part of surface nano-structuring methodology for biomedical applications by stressing the synergistic effect of protective metal oxide film of titanium in this advanced application.

Keywords

biomaterialmicrostructurechemical reaction
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1560: Symposium BB – Evolutions in Planarization—Equipment, Materials, Techniques and Applications , 2013 , mrss13-1560-bb04-05
Copyright
Copyright © Materials Research Society 2013 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Basim, G.B.. In Engineered Particulate Systems for Chemical Mechanical Planarization, Lambert Academic Publishing, Saarbrucken, Germany (2011).Google Scholar
Basim, G.B.. ECS Transactions, 25 (7), p. 315–326 (2009).CrossRefGoogle Scholar
Basim, G.B., Karagoz, A., Ozdemir, Z.. MRS Proceedings, Vol. 1428, mrss12-1428-c07-08 doi:10.1557/opl.2012.1361 (2012) DOI: 10.1557/opl.2012.1361(2012).CrossRefGoogle Scholar
Kaufman, F.B., Thomson, D.B. Broadie, R.E., Jaso, M.A., Guthrie, W.L., Pearson, M.B., Small, M.B., Journal of the Electrochemical Society, 138, pp. 3460 (1991).CrossRefGoogle Scholar
Bielman, M., Mahajan, U., Singh, R. K., Agarwal, P., Mischler, S., Rosset, E., Landolt, D., in Chemical Mechanical Polishing – Fundamentals and Challenges, Babu, S.V., Danyluk, S., Krishnan, M., Tsujimura, M., Editors, PV 566, p.97, Mater. Res. Soc. Proc., Pittsburgh, PA (2000).Google Scholar
Shibata, K., Kamegai, A., Titanium in dentistry: Biocompatibility of titanium. Quintessence, Tokyo, pp.35–41 (1988).Google Scholar
Kim, H., Choi, S-H., Ryu, J-J, Koh, S-Y., Park, J-H., Lee, I-S.. Biomed. Mater. 3, pp. 1–6 (2004).Google Scholar
Singh, R.G.. Journal of Dental Implants, Vol 2, Iss. 1, pp. 15–18 (2012).CrossRefGoogle Scholar
Kurella, A., Dahotre, N.B.. Journal of Biomaterials Applications, Vol. 20, p.p. 4–50 (2005).CrossRefGoogle Scholar
Yu, J., Yu, H., Guo, H., Li, M., S. Mann. Small, Vol. 4, Iss. 1, p.p. 87–91 (2008).CrossRefGoogle Scholar
Basim, G.B., Ozdemir, Z., Karagoz, A.. MRS Proceedings, 1464, mrss12-1464-rr03-14 doi:10.1557/opl.2012.1469 (2012).CrossRefGoogle Scholar
Basim, G.B., Ozdemir, Z., Mutlu, O. “Biomedical Applications of Chemical Mechanical Polishing” Proceedings of the International Conference on Planarization/CMP Technology, pp. 385, October (2012).Google Scholar