Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-26T20:32:13.290Z Has data issue: false hasContentIssue false

The Characterization and Electrical Properties of DOPED PZT Thin Films Prepared by Sol-Gel Processing

Published online by Cambridge University Press:  15 February 2011

Wan In Lee
Affiliation:
Materials & Device Research Center, Samsung Advanced Institute of Technology, P.O. Box 111, Suwon, Kyungki 440–600, Korea
J.K. Lee
Affiliation:
Department of Materials Science and Engineering, Virginia Tech, Blacksburg, VA 24061
Elsub Chung
Affiliation:
Department of Materials Science and Engineering, Virginia Tech, Blacksburg, VA 24061
C.W. Chung
Affiliation:
Department of Materials Science and Engineering, Virginia Tech, Blacksburg, VA 24061
I.K. Yoo
Affiliation:
Department of Materials Science and Engineering, Virginia Tech, Blacksburg, VA 24061
Seshu B. Desu
Affiliation:
Department of Materials Science and Engineering, Virginia Tech, Blacksburg, VA 24061
Get access

Abstract

PZT (Zr/Ti = 53/47), PNZT (4% Nb doped PZT), PSZT (2% Sc doped PZT), and PSNZT (1% Sc and 1% Nb doped PZT) thin films were prepared by a sol-gel process. They were characterized by XRD, SEM and TEM. Both crystallographic orientation and grain size of PZT films can be changed by doping. Pt/PZT/Pt capacitors were fabricated for the measurement of ferroelectric properties. By doping with both Sc and Nb, the fatigue performance of the PZT films was considerably improved and the coercive field was decreased, while the remanent polarization was not changed. In addition, the effect of dopants on the leakage current level of PZT films was studied.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Lin, C.T., Scanlan, B.W., Mcneill, J.D., Webb, J.S., and Li, L., J. Mater. Res., 7 (9), 2546 (1992).Google Scholar
2. Dana, S.S., Etzold, K.F., and Clabes, J., J. Appl. Phys., 69 (8), 4398 (1991).Google Scholar
3. Scott, J.F., Araujo, C.A., Melnick, B.M., McMillan, L.D., and Zuleeg, R., J. Appl. Phys., 70 (1), 382 (1991).Google Scholar
4. Scott, J.F., Melnick, B.M., Araujo, C.A., McMillan, L.D., and Zuleeg, R., Integrated Ferroelectrics, 1, 323 (1992).Google Scholar
5. Carim, A.H., Tuttle, B.A., Doughty, D.H., and Martinez, S.L., J. Am. Ceram. Soc., 74 (6), 1455 (1991).Google Scholar
6. Yi, G., Wu, Z., and Sayer, M., J. Appl. Phys., 64 (5), 2717 (1988).Google Scholar
7. Wu, Z. and Sayer, M., Proc. IEEE Int. Sym. On Application of Ferroelectrics. p. 244, Aug. 1992, Greenville, USA.Google Scholar
8. Iijima, K., Nagao, N., Takeuchi, T., Ueda, I., Tornita, Y., and Takayama, R., Mat. Res. Soc. Symp. Proc, 310, 455 (1993).Google Scholar
9. Krupanidhi, S.B., Roy, D., Maffei, N. and Peng, C.J., Integrated Ferroelectrics, 1, 253 (1992).Google Scholar
10. Chen, J., Harmer, M.P., and Smyth, D.M., Proc. IEEE Int. Sym. On Application of Ferroelectrics p. 111, Aug. 1992, Greenville, USA.Google Scholar