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Characteristics of Palladium Thin Films Deposited by the Ionized Cluster Beam Technique

Published online by Cambridge University Press:  22 February 2011

Maria Huffman ,
T. S. Kalkur ,
L. Kammerdiner ,
R. Kwor ,
L. L. Levenson  and
M. Reeder
Maria Huffman
Affiliation:
Ramtron Corparation, 1850 Ramtron Drive, Colorado Springs, CO 80921
T. S. Kalkur
Affiliation:
Department of Electrical and Computer Engineering, University of Colorado, Colorado Springs, CO 80833–7150
L. Kammerdiner
Affiliation:
Ramtron Corparation, 1850 Ramtron Drive, Colorado Springs, CO 80921
R. Kwor
Affiliation:
Department of Electrical and Computer Engineering, University of Colorado, Colorado Springs, CO 80833–7150
L. L. Levenson
Affiliation:
Department of Physics and Energy Science, University of Colorado, Colorado Springs, CO 80933–7150
M. Reeder
Affiliation:
Ramtron Corparation, 1850 Ramtron Drive, Colorado Springs, CO 80921
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Abstract

An ionized cluster beam (ICB) source was used to deposit Pd onto oxidized silicon substrates. The ICB source was operated in both the neutral mode (no ionization and no acceleration) and in the ICB mode with ionization and acceleration voltages at 3 kV and 6 k.V. Also, substrate temperatures were varied between 100°C and 400°C. The Pd film thicknesses were generally between 1, 200Å and 1, 800Å, with one film thickness about 500Å. The films were examined by transmission electron microscopy (TEM), transmission electron diffraction (TED), and x-ray diffraction (XRD). Grain size measurements by TEM and XRD showed that ionization and acceleration of Pd resulted in a slight increase in grain size compared to films deposited without ionization or acceleration at any substrate temperature. However, the grain size increased significantly as the substrate temperature rose. XRD showed that all ICB deposited Pd films have significant (111) texturing as determined by comparison to XRD data for Pd powder. For Pd films deposited at 400°C, almost all grains were oriented with the (111) planes parallel to the substrate surface. The electrical conductivity of all Pd films was comparable to that of bulk Pd.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 75
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

1. Movchan, B.A and Demchishin, A.V., Phys. Met. Metallogr. 28, 83 (1969).Google Scholar
2. Thornton, J.A., J. Vac. Sci. Technol. 11, 666 (1974).CrossRefGoogle Scholar
3. Thornton, J.A., An. Rev. Mat. Sci. 2, 239 (1977).CrossRefGoogle Scholar
4. Thornton, J.A., J. Vac. Sci. Technol. A4, 3059 (1986).CrossRefGoogle Scholar
5. Messier, P., Giri, A.P. and Roy, R.A., J. Vac. Sci. Technol. A2, 500 (1984).CrossRefGoogle Scholar
6. Levenson, L.L., Swartzlander, A.B., Usui, H., Yamada, I., and Takagi, T., Mater. Res. Soc. Symp. Proc. 128, 131 (1989).CrossRefGoogle Scholar
7. Muller, K-H., J. Vac. Sci. Technol. A6, 1690 (1988).CrossRefGoogle Scholar
8. Yamada, I. and Takagi, T., IEEE Trans. Electron Devices, ED-34. 1018 (1987).CrossRefGoogle Scholar
9. Roy, R.A., Cuomo, J.J., and Yee, D.S., J. Vac. Sci. Technol. A6, 1621 1988).CrossRefGoogle Scholar
10. Takagi, T., Z. Phys. D3, 271 (1986).Google Scholar
11. Takagi, T., Physics of Thin Films, 12, 1 (1987).Google Scholar