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Characterisation of Pointed Indentation Fracture of Thin Silica Films on a Ductile Substrate.

Published online by Cambridge University Press:  22 February 2011

M. Samandi ,
T. J. Bell  and
M. V. Swain
M. Samandi
Affiliation:
Department of Materials Engineering, The University of Wollongong, Wollongong, N.S.W 2500
T. J. Bell
Affiliation:
CSIRO, Division of Applied Physics, Lindfield, N.S.V. 2070, Australia
M. V. Swain
Affiliation:
CSIRO, Division of Applied Physics, Lindfield, N.S.V. 2070, Australia
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Abstract

Observations are presented of the indentation of amorphous silica films of different thickness on mild steel substrates. The films were prepared by sol—gel dip coating and sintering at 500° C. Indentation of the films with a Berkovich indenter using an ultra micro—indentation hardness system (UMIS) revealed a critical load for the fracture of the thin films. The variation of the fracture load was characterised by a Weibull analysis that gave a mean fracture load and a Weibull modulus. The latter was found to be nearly independent of film thickness whereas the former varied with the square of the thickness.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 355
Copyright
Copyright © Materials Research Society 1992

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References

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