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Ceramic Substrates - Micro Circuits, a Partnership in Growth

Published online by Cambridge University Press:  22 February 2011

William M. Flock
William M. Flock*
Affiliation:
Coors Porcelain Company, 600 9th St., Golden, Colorado 80401
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Abstract

An increased understanding and utilization of suhstrate properties will he required to improve future performance and reliability of microelectronic devices. Previously, only the passive substrate/package properties were required for micro devices. Newer designs are utilizing both the active and passive properties of the ceramic materials. These new demands are being driven by end user circuit needs, and will generate major changes in the processing and fabrication of oxide materials.

The status of oxide raw material availability, and the characterization of these materials is reviewed. The processing, and fabrication of substrate materials and the interactions with end use properties are discussed. The future expectations and demand on the materials and processes are forecasted. Substrate properties and their impact on final circuit performance are emphasized.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 7
Copyright
Copyright © Materials Research Society 1985

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