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Ceramic Fiber - Fluoropolymer Composites for Electronic Packaging Materials

Published online by Cambridge University Press:  21 February 2011

John D. Bolt
John D. Bolt*
Affiliation:
E. I. du Pont de Nemours & Co., Experimental Station, Wilmington, DE 19880-0262
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Abstract

Aluminum nitride (AIN), alumina and aramid fibers have been incorporated into epoxy and fluoropolymer matrices. The fluoropolymer composites have dielectric constants less than 3.4 and losses below 0.3%, measured out-of-plane. In-plane and out-of-plane thermal conductivities of the AIN-fluoropolymer composites averaged 5.2 and 1.3 W/mK, respectively, at fiber volume fractions of 0.26 to 0.29. In-plane thermal conductivities of woven fabric composites were accurately predicted by mixing rules; for non-woven and short fiber composites, thermal conductivities were less than predicted. These composites had higher out-of-plane thermal conductivities due to out-of-plane components of the fiber orientations.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 155: Symposium L – Processing Science of Advanced Ceramics , 1989 , 149
Copyright
Copyright © Materials Research Society 1989

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References

REFERENCES

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