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Bulge Test Investigation of The Influence of Moisture on Mechanical Properties of Thin Polymer Layers

Published online by Cambridge University Press:  10 February 2011

A. Nakladal
Affiliation:
Dresden University of Technology, Dresden, Germany
R. Buchhold
Affiliation:
Dresden University of Technology, Dresden, Germany
R. Köhler
Affiliation:
Dresden University of Technology, Dresden, Germany
G. Gerlach
Affiliation:
Dresden University of Technology, Dresden, Germany
M. Stavrev
Affiliation:
Dresden University of Technology, Dresden, Germany
C. Wenzel
Affiliation:
Dresden University of Technology, Dresden, Germany
K. Baumann
Affiliation:
AKTIV SENSOR, Stahnsdorf, Germany
B. Nowak
Affiliation:
AKTIV SENSOR, Stahnsdorf, Germany
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Abstract

Thin polymer layers gain importance as interlevel dielectrics in microelectronic devices. One major drawback of this class of material is instability of mechanical properties under changing climatic condition. The paper deals with evaluation of the bulge test as complementary method for investigation of humidity induced alterations of mechanical properties. It describes measurement of intrinsic as well as humidity induced stress in polymer layers. The given results agree very well with those obtained by substrate bending. Furthermore, bulge testing proved the assumption of earlier work, that change of mechanical stress is due to a humidity induced swelling process that can be described phenomenologically by expansion coefficient and a biaxial Young's modulus independent from relative humidity. Results are given and discussed for two types of polyimide.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

[1] Buchhold, R., presented at the 1998 MRS Spring Meeting, San Francisco, CA, 1998.Google Scholar
[2] Buchhold, R., Nakladal, A., Gerlach, G., Sahre, K., and Eichhorn, K.-J., Thin Solid Films, 312 (1-2), 238 (1998).Google Scholar
[3] Lin, P., Senturia, S. : The In-situ Measurement of Biaxial Modulus And Residual Stress of Multilayer Pol. Material Research Society Symposium. Materials Research Society. 188 (1990). pp. 4146.Google Scholar
[4] Senturia, S., Noe, S., Pan, J.: Physical Characterization of Microelectronic Polymeric Thin Films. Material Research Society Symposium. 227 (1991). pp. 167176.Google Scholar
[5] Small, M., Vlassak, J., Powell, S.: Accuracy And Reliability of Bulge Test Experiments. Material Research Society Symposium. 308 (1993). pp. 159164.Google Scholar
[6] Sheth, K. C., Chen, M. J., and Farris, R. J., in Polyimides: Trends in Materials and Applications, edited by Feger, C., Khojasteh, M. M., and Molis, S. E., Soc. Plast. Eng. NY, 1996, pp. 303311.Google Scholar
[7] Senturia, S. D., in Polymers for Microelectronics, Edited by Tabata, Y., Nonogaki, I. M. S., Horie, K., Tagawa, S., (VCH, New York, 1990), pp. 637654.Google Scholar