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Bonding of Cu wires by solid state sintering of Ag nanoparticles at low temperatures

Published online by Cambridge University Press:  31 January 2011

Hani Alarifi ,
Anming Hu ,
Mustafa Yavuz  and
Y. Zhou
Hani Alarifi
Affiliation:
[email protected], University of Waterloo, Waterloo, Canada
Anming Hu
Affiliation:
[email protected], University of Waterloo, Waterloo, Canada
Mustafa Yavuz
Affiliation:
[email protected], University of Waterloo, waterloo, Canada
Y. Zhou
Affiliation:
[email protected], University of Waterloo, Waterloo, Canada
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Abstract

Solid state sintering of Ag nanoparticles was used to bond Cu wires to Cu foils at temperatures less than 250°C. The Ag nanoparticles are coated with an organic shell to prevent sintering at room temperature. After annealing the nanoparticles at 200°C, the decomposition of the organic shell was confirmed using TGA and Raman spectroscopy. The joint strength was measured by tensile shear tests, which shows that the joint strength increases as the bonding temperature increases. Metallic bond between Ag nanoparticles and Cu was achieved with no contamination. Bonds formed by our method, was confirmed to withstand temperatures higher than the bonding temperatures.

Keywords

Agnanoscalesintering
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1207: Symposium N – Colloidal Nanoparticles for Electronic Applications — Light Emission, Detection, Photovoltaics and Transport , 2009 , 1207-N07-36
Copyright
Copyright © Materials Research Society 2010

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References

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