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Atomic-Scale Simulation of Adhesion Between Metallic Surfaces

Published online by Cambridge University Press:  26 February 2011

Paul A. Taylor
Paul A. Taylor*
Affiliation:
Sandia National Laboratories, P.O. Box 5800, Albuquerque, NM 87185
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Abstract

We have performed MD simulations of adhesive phenomena, on an atomic scale, between metals possessing both smooth and stepped-surfaces. Studies of adhesion between identical metals, consisting of either Au, Cu, or Ni, with (001) or (111) orientations, reveal the existence of adhesive avalanches as the bodies are brought to within a critical separation (˜2Å). That is, as the surfaces approach one another, one or both surface layers becomes unstable, and abruptly moves towards the other. This signals a transition from an initial system with two distinct surfaces to one possessing no identifiable surfaces. Th presence of adhesive avalanches will pose difficulties in determining adhesive forces and energies by means of atomic forcemicroscopy at sub-nanometer separations of probe tip and sample surface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 209: Symposium K – Defects in Materials , 1990 , 225
Copyright
Copyright © Materials Research Society 1991

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References

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