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The Aspects of Thermal Anneal to Intrinsic Stress and Hicrostructure of Multilayer Thin Films

Published online by Cambridge University Press:  22 February 2011

C. H. Yang  and
P.C. Chen
C. H. Yang
Affiliation:
Department of Vacuum Metallization, Systems Technology Division, IBM, Endicott, NY 13760
P.C. Chen
Affiliation:
Department of Vacuum Metallization, Systems Technology Division, IBM, Endicott, NY 13760
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Abstract

Adhesion degradation mechanism at the interface of a multilayer thin film was studied as a function of annealing temperature. The multilayer thin films employed for current investigation of the temperature effect were constructed by sputtering 500 Å Cr and 10K Å Cu on both sides of kapton. A steady decrease of adhesion strength was found as a result of increasing the annealing temperature from 150°C to 350°C. Thin film and interfacial properties in association with degradation of adhesion were characterized by several techniques, including intrinsic stress measurement, Auger, TEN and SIMS. Several changes were observed by elevating the annealing temperature. It was found that the intrinsic stress in each layer changed. Both Cu and Cr grain size increased with the annealing temperature. The interface at kapton and metal became more defined. The Cu atoms were found to become mobile and diffused into Cr and kapton layer after a 350 degree annealing. In addition, a change of molecular orientation and chemistry in kapton near the interface was observed by SIMS and XPS studies. A combination of these factors resulted in a decline of adhesion strength.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 153: Symposium J – Interfaces Between Polymers, Metals, and Ceramics , 1989 , 291
Copyright
Copyright © Materials Research Society 1989

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References

(1). Chen, S. T., Yang, C. H., Faupel, F. and Ho, P. S., “Stress Relaxation During Thermal Cycling in Metal/Polyimide Layered Films” J. Appl. Phys. 64 (12), 15 Dec. 1988 Google Scholar
(2). Chen, P. C. and Oshida, Y. “Residual Stress Analysis of a Multilayer Thin Film Structure by Destructive (Curvature) and Non-Destructive (X-ray) Methods” submitted to MRS 1989 Spring Meeting.Google Scholar
(3). Ooij, W. J. Van and Nahmias, M. “Surface Characterization of Rubber by Secondary Ion Mass Spectrometry” Presented at a Meeting of Rubber Division, American Chemical Society, October 18-21, 1988.Google Scholar