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Application of Superplasticity in Solder Joints

Published online by Cambridge University Press:  25 February 2011

M. C. Shine ,
J. Seyyedi ,
T. Massingill ,
Z. Mei  and
J. W. Morris Jr.
M. C. Shine
Affiliation:
Digital Equipment Corporation, 10500 Ridgeview Court, Cupertino CA, 95014
J. Seyyedi
Affiliation:
Digital Equipment Corporation, TWO, Tewksbury MA, 01876
T. Massingill
Affiliation:
Digital Equipment Corporation, 10500 Ridgeview Court, Cupertino CA, 95014
Z. Mei
Affiliation:
Lawrence Berkeley Laboratory, Department of Materials ScienceUniversity of California, Berkeley CA, 94720
J. W. Morris Jr.
Affiliation:
Lawrence Berkeley Laboratory, Department of Materials ScienceUniversity of California, Berkeley CA, 94720
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Abstract

The lifetime of non-compliant eutectic solder joints was improved by an order magnitude by rapid quenching. The quenching produces a fine equiaxed superplastic grain structure which lowers the stresses in the solder joints for the fatigue cycle strain range. Similarly, compliant J Bend and Gull wing joints, which last thousands of cycles, operate at lower stresses where superplastic deformation predominates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 425
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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