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Application Of Electroless Copper Plating Technology For Thin Film Laminated Multilayer Wiring Board

Published online by Cambridge University Press:  10 February 2011

T. Itabashi ,
H. Akahoshi ,
A. Takahashi ,
M. Suzuki  and
M. Maeda
T. Itabashi
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd. 7-1–1 Omika, Hitachi-shi, Ibaraki 319–12 Japan
H. Akahoshi
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd. 7-1–1 Omika, Hitachi-shi, Ibaraki 319–12 Japan
A. Takahashi
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd. 7-1–1 Omika, Hitachi-shi, Ibaraki 319–12 Japan
M. Suzuki
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd. 7-1–1 Omika, Hitachi-shi, Ibaraki 319–12 Japan
M. Maeda
Affiliation:
Hitachi Kyowa Engineering Co. Ltd. Analysis & Testing Div., 7–1-1 Omika, Hitachi-shi, , Ibaraki 319–12 Japan
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Abstract

A thin film laminated high density multilayer wiring board was developed using electroless copper plating technology. The basic steps in the fabrication process are: laminating the high heat resistant polymer film, forming via holes by plasma etching and filling them by electroless copper metallization. The 25 μm diameter via holes can be completely filled with copper using the selective electroless plating method. This paper describes the fabrication process, focusing particularly on electroless copper plating.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 39
Copyright
Copyright © Materials Research Society 1997

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