Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-27T02:04:09.063Z Has data issue: false hasContentIssue false
  • English
  • Français

Application Of Electroless Copper Plating Technology For Thin Film Laminated Multilayer Wiring Board

Published online by Cambridge University Press:  10 February 2011

T. Itabashi ,
H. Akahoshi ,
A. Takahashi ,
M. Suzuki  and
M. Maeda
T. Itabashi
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd. 7-1–1 Omika, Hitachi-shi, Ibaraki 319–12 Japan
H. Akahoshi
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd. 7-1–1 Omika, Hitachi-shi, Ibaraki 319–12 Japan
A. Takahashi
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd. 7-1–1 Omika, Hitachi-shi, Ibaraki 319–12 Japan
M. Suzuki
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd. 7-1–1 Omika, Hitachi-shi, Ibaraki 319–12 Japan
M. Maeda
Affiliation:
Hitachi Kyowa Engineering Co. Ltd. Analysis & Testing Div., 7–1-1 Omika, Hitachi-shi, , Ibaraki 319–12 Japan
Get access

Abstract

A thin film laminated high density multilayer wiring board was developed using electroless copper plating technology. The basic steps in the fabrication process are: laminating the high heat resistant polymer film, forming via holes by plasma etching and filling them by electroless copper metallization. The 25 μm diameter via holes can be completely filled with copper using the selective electroless plating method. This paper describes the fabrication process, focusing particularly on electroless copper plating.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 39
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Wilcox, D. L., Solid-State Tech. 1971, 40.Google Scholar
2 Jansen, R. J., Cummings, J. P., and Vora, H., in Proc. 34th Electronic Components Conf., 73 (1984).Google Scholar
3 Inoue, T., Matsuyama, H., Matsuzaki, E., Narizuka, Y., and Ishino, M., in Proc. 42nd Electronic Components and Technology Conf., 704 (1992).Google Scholar
4 Pan, J. T., Poon, S. and Nelson, B., in Proc. 8th IEPS, 174 (1988).Google Scholar
5 Miura, O., Miyazaki, K., Takahashi, A., Watanabe, R. and Miwa, T., IEEE Trans. Comp. Hybrids, Manufact. Technol., 16, 817 (1993).Google Scholar
6 Hammond, J., Circuit World, 20 (1), 7 (1993).Google Scholar
7 Itabashi, T., Suzuki, M., Watanabe, R., Okoshi, Y., Suzuki, H., Akahoshi, H. and Takahashi, A., in Proc. 1995 Japan TEMT Symposium, pp. 318–322.Google Scholar
8 Takahashi, A., Itabashi, T., Watanabe, R., Miwa, T., Akahoshi, H., in Proc. Printed Circuit World Convention VII, 13 (1996).Google Scholar
9 Akahoshi, H., Kawamoto, M., Itabashi, T., Miura, O., Takahashi, A., Kobayashi, S., Miyazaki, M., Mutoh, T., Wajima, M. and Ishimaru, T., IEEE Trans. Comp. Hybrids, Manufact. Technol., 18, 127(1995).Google Scholar
10 Takahashi, T., Itabashi, T. and Akahoshi, H., in Proc. 90th Meeting of Surface Finishing Society Japan, 170(1994).Google Scholar
11 Jacobs, Jan W. M. and Rikken, Jan M. G., J. of Electrochem. Soc, 135 (11), 2822 (1988).Google Scholar