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Annealing Effects of Schottky Contacts on the Characteristics of 4H-SiC Schottky Barrier Diodes
Published online by Cambridge University Press: 10 February 2011
Abstract
This paper reports on the relationship between the microstructure and the device performance of Pt/4H-SiC schottky barrier diodes ( SBDs ). The evolution of microstructure in the metal/SiC interfaces annealed at different temperatures was characterized using X-ray scattering techniques. The reverse characteristics of the devices were degraded with annealing temperatures. The maximum breakdown voltages of as-deposited devices and 850 °C annealed devices are 1300 V and 626 V, respectively. However, the forward characteristics of the devices were found out to improve with annealing temperatures. X-ray scattering analysis showed that Pt-silicides were formed by annealing performed at or higher than 650 °C. The formation of silicides was shown to increase the roughness of the Pt/SiC interface. It is believed that the forward characteristics of the SBDs be strongly dependent on the crystallity of silicides formed in the Pt/SiC interface during the annealing process.
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- Copyright © Materials Research Society 1999
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