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Analysis of Successive Focused Ion Beam Slices by Scanning Electron Imaging and 3D Reconstruction

Published online by Cambridge University Press:  26 February 2011

Terence Yeoh
Affiliation:
[email protected], The Aerospace Corporation, Materials Technology Department, 2350 E El Segundo Blvd, El Segundo, CA, 90245, United States, 310-336-1616
Neil Ives
Affiliation:
[email protected], The Aerospace Corporation, Microelectronics Technology Department, United States
Nathan Presser
Affiliation:
[email protected], The Aerospace Corporation, Microelectronics Technology Department, United States
Gary Stupian
Affiliation:
[email protected], The Aerospace Corporation, Microelectronics Technology Department
Martin Leung
Affiliation:
[email protected], The Aerospace Corporation, Microelectronics Technology Department, United States
John McCollum
Affiliation:
[email protected], Actel Corporation, United States
Frank Hawley
Affiliation:
[email protected], Actel Corporation, United States
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Abstract

An antifuse structure was analyzed using scanning electron microscope imaging and focused ion beam image slicing to generate a form of three-dimensional microscopy. This method reveals nanometer scale features that could not be easily imaged using a single focused ion beam cross-section. A novel end-point detection technique has been developed to control the thickness of the slice to about 2 nm. Voxel imaging and interpretive three-dimensional reconstruction was used to resolve volumes as small as 2 cubic nm3. It was determined that the fusing region for an antifuse is a complex mixture of material phases with an elliptical volume approximately 75 nm in diameter.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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