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An Overview and Comparison of Rapid Thermal Processing Equipment: a Users Viewpoint

Published online by Cambridge University Press:  26 February 2011

S. R. Wilson ,
R. B. Gregory  and
W. M. Paulson
S. R. Wilson
Affiliation:
Semiconductor Research and Development Laboratories, Motorola, Inc.5005 E. McDowell Rd., Phoenix, Az. 85008
R. B. Gregory
Affiliation:
Semiconductor Research and Development Laboratories, Motorola, Inc.5005 E. McDowell Rd., Phoenix, Az. 85008
W. M. Paulson
Affiliation:
Semiconductor Research and Development Laboratories, Motorola, Inc.5005 E. McDowell Rd., Phoenix, Az. 85008
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Abstract

Five different RTP units have been examined. These are the Varian RTP-800, the Eaton ROA-400, the A.G. Associates 2101/2106, the Tamarack 180A-C and the Varian IA-200. Each system is a cassette-to-cassette serial processor designed for use in a high volume semiconductor fabrication line. These units will heat a wafer from room temperature to 400–1400C in times on the order of a few seconds. Each unit uses radiation to heat and cool the wafer. The different radiation sources, wafer handling systems, temperature measurements and control computers are discussed. The control of slip and nonuniform temperatures is presented as well as information regarding the types of ambients that can be used in each system.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 52: Symposium B – Rapid Thermal Processing , 1985 , 181
Copyright
Copyright © Materials Research Society 1986

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References

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