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Published online by Cambridge University Press: 16 February 2011
For materials that are conducive to pre-thinning by mechanical techniques, a combination of dimpling and ion milling is commonly employed to produce TEM specimens. In order to minimize artifacts induced by ion milling and to provide an increased electron-beam transparent area, new instrumentation for mechanical thinning has been developed. Examples illustrating the utilization of this instrument in the preparation of cross-sectional interfaces from layered samples are discussed.