Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2024-12-27T02:24:31.637Z Has data issue: false hasContentIssue false

An ab initio Investigation on the Effects of Impurity in Aluminum Grain Boundary

Published online by Cambridge University Press:  17 March 2011

Guang-Hong Lu
Affiliation:
Institute of Industrial Science, University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
Tomoyuki Tamura
Affiliation:
Institute of Industrial Science, University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
Masao Kamiko
Affiliation:
Institute of Industrial Science, University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
Masanori Kohyama
Affiliation:
Special Division of Green Life Technology, AIST Kansai, 1-8-31 Midorigaoka, Ikedashi, Osaka 563-8577, Japan
Ryoichi Yamamoto
Affiliation:
Institute of Industrial Science, University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
Get access

Abstract

The electronic structure of AlS9 tilt grain boundary with segregated impurity atoms of Na, Ca, Si and S, respectively, has been investigated by an ab initio pseudopotential method. Na and Ca segregation causes the boundary to expand and the charge density to decrease significantly. There forms several weak bond regions. Si segregation increases the charge density between Si and the neighboring Al atom. There forms a stronger Al-Si bond that is a mixture of covalent and metallic character in the boundary. For S segregation, though there forms the stronger bond between Al and S atom, some Al-S bonds may become weaker than the former Al-Al bonds because of the charge density decrease. It is concluded that the mechanism of Na or Ca-promoted Al grain boundary embrittlement is one kind of ‘decohesion model’, that of Si is ‘bond mobility model’. It can't be decided the embrittlement mechanism by S segregation is classified into ‘bond mobility model’ or ‘decohesion model’.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Losch, W., Acta Metallurgica, 27, 1885 (1979)Google Scholar
2. Briant, C.L. and Messmer, R.P., Phil. Mag. B, 42, 569 (1980)Google Scholar
3. Messmer, R.P. and Briant, C.L., Acta. Metall., 30, 457 (1982)Google Scholar
4. Haydock, R., J. Phys. C: Solid State Phys., 14, 3807 (1981)Google Scholar
5. Goodwin, L., Needs, R.J. and Heine, V., Phys. Rev. Lett., 60, 2050 (1988)Google Scholar
6. Goodwin, L., Needs, R.J. and Heine, V., J. Phys: Condens. Matter, 2, 351 (1990)Google Scholar
7. Okada, H. and Kanno, M., Scripta Materialia 37, 781 (1997)Google Scholar
8. Horikawa, K., Kuramoto, S. and Kanno, M., Scripta materialia 39, 860 (1998)Google Scholar
9. Horikawa, K., Ph.D. thesis, University of Tokyo (1999)Google Scholar
10. Hinode, K., Owada, N., Nishida, T. and Mukai, K., J. Vac. Sci. Technol. B5, 518 (1987)Google Scholar
11. Mills, M.J. and Daw, M.S., Mat. Res. Soc. Symp. Prov., 183, 15 (1990)Google Scholar
12.For example, Pickett, W.E., Comput. Phys. Rep., 9 115 (1989)Google Scholar
13. Hohenberg, P. and Kohn, W., Phys. Rev. 136B, 864(1964)Google Scholar
14. Kohn, W. and Sham, L.S., Phys. Rev. 140A, 1133 (1965)Google Scholar
15. Perdew, J.P. and Zunger, A., Phys. Rev. B, 23, 5048 (1981)Google Scholar
16. Bylander, D.M., Kleinman, L. and Lee, S., Phys. Rev. B, 42, 1394 (1990)Google Scholar
17. Troullier, N. and Martins, J.L., Phys. Rev. B, 43, 1993 (1991)Google Scholar
18. Hamann, D.R., Schluter, M. and Chiang, C., Phys. Rev. Lett., 43, 1494 (1979)Google Scholar
19. Bachelet, G.B., Hamman, D.R. and Schluter, M., Phys. Rev. B, 26, 4199 (1982)Google Scholar
20. Louie, S.G., Froyen, S. and Cohen, M.L., Phys. Rev. B, 26, 1738 (1982)Google Scholar
21. Kleinman, L. and Bylander, D.M., Phys. Rev. Lett., 48, 1425 (1982)Google Scholar
22. Nielsen, O.H. and Martin, R.M., Phys. Rev. B, 32, 3780 (1985)Google Scholar