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All-Printed Inorganic Logic Elements Fabricated by Liquid Embossing

Published online by Cambridge University Press:  10 February 2011

Colin Bulthaup
Affiliation:
Media Lab, Massachusetts Institute of Technology, Cambridge, MA 02139
Eric Wilhelm
Affiliation:
Media Lab, Massachusetts Institute of Technology, Cambridge, MA 02139
Brian Hubert
Affiliation:
Media Lab, Massachusetts Institute of Technology, Cambridge, MA 02139
Brent Ridley
Affiliation:
Media Lab, Massachusetts Institute of Technology, Cambridge, MA 02139
Joe Jacobson
Affiliation:
Media Lab, Massachusetts Institute of Technology, Cambridge, MA 02139
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Abstract

The liquid embossing process, devices made by this process, and their characteristics are presented. Structures fabricated and discussed here include: conductive lines with cross line resistance greater than 100 GΩ and resistivities 4 times that of the bulk material, multilayer structures with etched sacrificial materials, vias that conduct through an embossed insulating layer, photodetectors made with nanocrystal solutions of CdSe, and all printed inorganic field effect transistors.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

1 Ridley, B. A., Nivi, B., Hubert, B. N., Bulthaup, C., Wilhelm, E. J. & Jacobson, J. M. Solution-Processed Inorganic Transistors and Sub-Micron Non-Lithographic Patterning Using Nanoparticle Inks. 1999 MRS Fall Meeting Proc., Nanophase and Nanocomposite Materials III (1999).Google Scholar
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4 Ridley, B. A., Nivi, B. & Jacobson, J. M. All-Inorganic Field Effect Transistors Fabricated by Printing. Science 286, 746749 (1999).Google Scholar