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AFM Measurements of Adhesion between Actual CMP Slurry Particles and Various Substrates

Published online by Cambridge University Press:  01 February 2011

Yong Liu ,
Bogdan Zdyrko ,
Alex Tregub ,
Mansour Moinpour ,
Mark Buehler  and
Igor Luzinov
Yong Liu
Affiliation:
School of Materials Science and Engineering, Clemson University, SC 29634, U.S.A.
Bogdan Zdyrko
Affiliation:
School of Materials Science and Engineering, Clemson University, SC 29634, U.S.A.
Alex Tregub
Affiliation:
1Intel Corporation, CMO/FMO, Santa Clara, CA, U.S.A.
Mansour Moinpour
Affiliation:
1Intel Corporation, CMO/FMO, Santa Clara, CA, U.S.A.
Mark Buehler
Affiliation:
Intel Corporation, PTD, Hillsboro, OR, U.S.A.
Igor Luzinov
Affiliation:
School of Materials Science and Engineering, Clemson University, SC 29634, U.S.A.
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Abstract

One of the critical parameters in chemical mechanical polishing (CMP) technology is adhesion between abrasive particles and surfaces being polished. Accumulated up to date theoretical and experimental facts insist that development of advanced material removal and cleaning methods requires understanding and evaluation of particle adhesion in these processes. To this end, our research focuses on AFM studies of interaction between the slurry particles and different substrates treated by CMP processes. To conduct adhesion measurements, the particles present in a CMP system and model latex particle were first attached to the surface of silicon wafer covered with monolayer of polymer(s) having high affinity to particles and the silicon wafer. Glass/quartz sphere (10-60 microns) was attached to AFM cantilever with appropriate spring constant. (The sphere represented the surface of material being polished and might be covered with various materials during future investigations.) Next, AFM force volume mode, which utilizes the collection of the force-distance curves over selected surface areas, was used for the adhesion measurements.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W2.5
Copyright
Copyright © Materials Research Society 2005

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