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Advances in Rtp Temperature Measurement and Control

Published online by Cambridge University Press:  10 February 2011

Bruce Peuse ,
Gary Miner ,
Mark Yam  and
Curtis Elia
Bruce Peuse
Affiliation:
Applied Materials Thermal Processing Organization, 2727 Augustine Drive MS 0755, Santa Clara, CA 95054,USA, [email protected], [email protected], [email protected]
Gary Miner
Affiliation:
Applied Materials Thermal Processing Organization, 2727 Augustine Drive MS 0755, Santa Clara, CA 95054,USA, [email protected], [email protected], [email protected]
Mark Yam
Affiliation:
Applied Materials Thermal Processing Organization, 2727 Augustine Drive MS 0755, Santa Clara, CA 95054,USA, [email protected], [email protected], [email protected]
Curtis Elia
Affiliation:
Oakleaf Engineering, Inc., 643 Bair Island Road, Suite 208, Redwood City, CA 94063, USA,[email protected]
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Abstract

This paper reviews work to develop and improve the temperature measurement and control technology of a commercial rapid thermal processing (RTP) system. A description of the main features of this system is given, which includes a concentric multi-zone lamp heating source, multi-point temperature measurement system and real time wafer temperature control. Innovations in RTP optical thermometry are described which resulted in improved low temperature performance, a real time spectral emissivity measurement tool which enables emissivity independent temperature measurement and an improved temperature calibration capability. The multi-input multi-output (MIMO) optimal wafer temperature control methodology is discussed. Process results demonstrating an equivalent process temperature performance of 4°C, 3-sigma, all-points-all-wafers will be presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 525: Symposium W – Rapid Thermal & Integrated Processing VII , 1998 , 71
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

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