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Advances in Encapsulating Elastically Stretchable Microelectrode Arrays

Published online by Cambridge University Press:  15 March 2011

Oliver Graudejus ,
Candice Tsay ,
Sigurd Wagner ,
Zhe Yu ,
Barclay Morrison III  and
Stephanie Lacour
Oliver Graudejus
Affiliation:
Electrical Engineering, Princeton University, Engineering Quadrangle, Olden Street, Princeton, NJ, 08544
Candice Tsay
Affiliation:
Electrical Engineering, Princeton University, Engineering Quadrangle, Olden Street, Princeton, NJ, 08544
Sigurd Wagner
Affiliation:
Electrical Engineering, Princeton University, Engineering Quadrangle, Olden Street, Princeton, NJ, 08544
Zhe Yu
Affiliation:
Biomedical Engineering, Columbia University, 351 Engineering Terrace, MC 8904, 1210 Amsterdam Avenue, New York, NY, 10027
Barclay Morrison III
Affiliation:
Biomedical Engineering, Columbia University, 351 Engineering Terrace, MC 8904, 1210 Amsterdam Avenue, New York, NY, 10027
Stephanie Lacour
Affiliation:
Material Science, Cambridge University, Cambridge, CB2 3QZ, United Kingdom
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Abstract

Stretchable microelectrode arrays (SMEAs) that are fabricated on the compliant silicone poly dimethyl siloxane (PDMS) have potential applications for research on traumatic brain injury (TBI). Increasing the number of electrodes in the array improves the accuracy in assessing the effects of traumatic injury to cell tissue cultures. The currently available encapsulation process with a photopatternable silicone limits the electrode density on the array. The present research examines four factors in the encapsulation process: exposure dose, scattered and reflected light as well as hard bake time. Careful optimization of these four factors leads to a significant reduction of the minimum feature size of a contact via patterned into the encapsulation layer, thus enabling an increase of the electrode density on the array.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1009: Symposium U – Advanced Materials for Neuroprosthetic Interfaces , 2007 , 1009-U04-02
Copyright
Copyright © Materials Research Society 2007

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References

1.www.cdc.gov, www.biausa.orgGoogle Scholar
2. Lacour, S. P., Yu, Z., Morrison, B. III, Tsay, C., and Wagner, S., Stretchable microelectrode arrays for dynamic neural recording of in vitro mechanically injured brain, Proceedings of the 4th IEEE Conference on Sensors, 2005, pp. 617–620.Google Scholar
3. Yu, Z., Tsay, C., Lacour, S.P., Wagner, S. and Morrison, B. III Stretchable microelectrode arrays: A tool for discovering mechanisms of functional deficits underlying traumatic brain injury and interfacing neurons with neuroprosthetics, Engineering in Medicine and Biology Society, 2006, 28 th International Conference of the IEEE, pp. 6732–6735.Google Scholar
4. Wagner, S., Lacour, S.P., Jones, J., Hsu, P.I., Sturm, J., Li, T., Suo, Z., Electronic skin: architecture and components, Physica E 25 (2004) 326–334.Google Scholar
5. Lacour, S.P., Wagner, S., Thin film transistor circuits integrated onto elastomeric substrates for elastically stretchable electronics, Electron Devices Meeting, 2005, IEDM Technical Digest, IEEE International, pp. 101–104.Google Scholar